LM3269

SNVS793D – NOVEMBER 2011 – REVISED MAY 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

PVIN, VOUT to GND

−0.2

6

V

EN, VCON to SGND, PGND

−0.2

(3)

V

FB to PGND

−0.2

(3)

V

SW1, SW2

−0.2

(3)

V

Internally limited

150

°C

−65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

Whichever is smaller.

(4)

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

NOM

MAX

UNIT

Input voltage

2.7

5.5

V

Output voltage

0.6

4.2

V

Recommended load current

0

750

mA

−30

125

°C

(3)

−30

85

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pins.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

6.4 Thermal Information

LM3269

YZR (DSBGA)

UNIT

12 PINS

85

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power

is taken from a thermal modeling result, performed under the conditions and guidelines set forth in the JEDEC standard JESD51-7.

4

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