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5962R8958704VXA Datasheet(PDF) 3 Page - Texas Instruments |
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5962R8958704VXA Datasheet(HTML) 3 Page - Texas Instruments |
3 / 17 page LM2940QML, LM2940QML-SP www.ti.com SNVS389B – MAY 2010 – REVISED MAY 2013 Absolute Maximum Ratings (1) Input Voltage (Survival Voltage ≤ 100mS) 60V Internal Power Dissipation with no heat sink (TA = +25°C) (2) 1W Maximum Junction Temperature 150°C Storage Temperature Range −65°C ≤ TA ≤ +150°C Lead Temperature (Soldering 10 seconds) 300°C 16LD CFP "WG" (device 01, 02) (Still Air) 122°C/W 16LD CFP "GW" (device 03, 04) (Still Air) 136°C/W θJA 16LD CFP "WG" (device 01, 02) (500LF/Min Air flow) 77°C/W Thermal Resistance 16LD CFP "GW" (device 03, 04) (500LF/Min Air flow) 87°C/W 16LD CFP "WG" (device 01, 02)(3) 5°C/W θJC 16LD CFP "GW" (device 03, 04) 13°C/W Package Weight CFP "WG" (device 01, 02) 360 mg Package Weight CFP "GW" (device 03, 04) 410 mg ESD Susceptibility(4) 4KV (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For specified specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. (2) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature), θJA (package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PDmax = (TJmax - TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower. With heat sinking, the maximum power is 5 Watts, but then this will depend upon the temperature of the heat sink, the efficiency of the heat sink, and the efficiency of the heat flow between the package body and the heat sink. We can not predict these values. (3) The package material for these devices allows much improved heat transfer over our standard ceramic packages. In order to take full advantage of this improved heat transfer, heat sinking must be provided between the package base (directly beneath the die), and either metal traces on, or thermal vias through, the printed circuit board. Without this additional heat sinking, device power dissipation must be calculated using θJA, rather than θJC, thermal resistance. It must not be assumed that the device leads will provide substantial heat transfer out of the package, since the thermal resistance of the lead frame material is very poor, relative to the material of the package base. The stated θJC thermal resistance is for the package material only, and does not account for the additional thermal resistance between the package base and the printed circuit board. The user must determine the value of the additional thermal resistance and must combine this with the stated value for the package, to calculate the total allowed power dissipation for the device. (4) Human body model, 1.5 k Ω in series with 100 pF. Recommended Operating Conditions (1) Input Voltage 26V Temperature Range −55°C ≤ TA ≤ 125°C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For specified specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Copyright © 2010–2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM2940QML LM2940QML-SP |
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