BUF12840

www.ti.com

SBOS519A

– OCTOBER 2010 – REVISED JULY 2011

ELECTRICAL CHARACTERISTICS

BUF12840

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNIT

ANALOG GAMMA BUFFER CHANNELS

Reset value

Code 0

0

V

OUT1 to OUT12 output swing: high

Code = 1023, sourcing 10mA

17.7

17.85

V

OUT1 to OUT12 output swing: low

Code = 0, sinking 10mA

0.07

0.3

V

OUT1 to OUT12 output swing: high

Code = 1023, sourcing 5mA

17.8

17.9

V

OUT1 to OUT12 output swing: low

Code = 0, sinking 5mA

0.07

0.2

V

Continuous output current

30

mA

Output accuracy

Code 512

±20

±50

mV

vs Temperature

Code 512

±25

μV/°C

Integral nonlinearity

INL

0.3

Bits

Differential nonlinearity

DNL

0.3

Bits

Load regulation, 10mA

REG

0.5

1.5

mV/mA

ANALOG POWER SUPPLY

Operating range

9

20

V

Total analog supply current

Outputs at midscale with no load

6.5

10

mA

Over temperature

19

mA

Logic 1 input voltage

0.7

V

Logic 0 input voltage

0.3

V

Logic 0 output voltage

0.15

0.4

V

Input leakage

±0.01

±10

μA

Clock frequency

Standard/Fast mode

400

kHz

High-Speed mode

3.4

MHz

EEPROM read clock speed

Master mode

71

87

100

kHz

BANK switching delay

7

10

μs

DIGITAL POWER SUPPLY

Operating range

2.0

5.5

V

Two-Wire bus inactive

90

150

μA

Over temperature

115

175

μA

Power-on reset

POR

1.1

1.5

1.7

V

TEMPERATURE RANGE

Specified range

–40

+95

°C

Operating range

Junction temperature

< +125°C

–40

+95

°C

Storage range

–65

+150

°C

(1)

Observe maximum power dissipation. Exposed thermal die is soldered to the PCB using thermal vias. Refer to Texas Instruments

application report QFN/SON PCB Attachment (SLUS271).

(2)

Refers to pins EA0, EA1, EN, LD, SCL, SDA, A0, and BKSEL.

Copyright

© 2010–2011, Texas Instruments Incorporated

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