201

YMDS

YMB package package markings:

YM

= YEAR / MONTH DATE CODE

D

= DAY OF LASER MARK

S

= ASSEMBLY SITE CODE

0

= Pin A1 (Filled Solid)

I

SOURCE

VBAT

GND

C

B

A

2

1

I

SINK

SCL

SDA

I

SOURCE

VBAT

GND

C

B

A

2

1

I

SINK

SCL

SDA

YFM package has no top side markings

DRV201

www.ti.com

SLVSB25C – AUGUST 2011 – REVISED JUNE 2015

5 Pin Configuration and Functions

YFM Package

YMB Package

8-Pin PICOSTAR

6-Pin DSBGA

Bottom View and Top View

Bottom View and Top View

Pin Functions

PIN

I/O

DESCRIPTION

NAME

NO.

VBAT

2A

P

Power

GND

1A

P

Ground

I_SOURCE

2B

O

Voice coil positive terminal

I_SINK

1B

O

Voice coil negative terminal

SCL

2C

I

SDA

1C

I/O

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

–0.3

5.5

V

Voltage at SDA, SCL

–0.3

3.6

V

Continuous total power dissipation

Internally limited

Operating junction temperature

–40

125

°C

Operating ambient temperature

–40

85

°C

Storage temperature

–55

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground terminal.

6.2 ESD Ratings

VALUE

UNIT

±4000

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-C101, all

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

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