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DP83848M Datasheet(PDF) 10 Page - Texas Instruments |
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DP83848M Datasheet(HTML) 10 Page - Texas Instruments |
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10 / 84 page  DP83848H, DP83848J, DP83848K, DP83848M, DP83848T SNLS250E – MAY 2008 – REVISED APRIL 2015 www.ti.com 5 Specifications 5.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT VCC Supply voltage –0.5 4.2 V VIN DC input voltage –0.5 VCC + 0.5 V VOUT DC output voltage –0.5 VCC + 0.5 V Max case temperature 147.7 °C TJ Max die temperature 150 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All parameters are specified by test, statistical analysis or design. 5.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2) ±4000 V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification JESD22- ±1000 C101(3) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) RZAP = 1.5 kΩ, CZAP = 120 pF (3) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 5.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VCC Supply voltage 3.3 ±0.3 V TA Commerical - DP83848J/M 0 70 °C Ambient temperature Industrial - DP83848K/T –40 85 Extreme - DP83848H –40 125 PD Power dissipation 264 mW 5.4 Thermal Information DP83848x THERMAL METRIC(1) RTA [WQFN] UNIT 40 PINS RθJA Junction-to-ambient thermal resistance 31.7 RθJC(top) Junction-to-case (top) thermal resistance 8.8 RθJB Junction-to-board thermal resistance 40.5 °C/W ψJT Junction-to-top characterization parameter 0.4 ψJB Junction-to-board characterization parameter 10.5 RθJC(bot) Junction-to-case (bottom) thermal resistance 5.5 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 10 Specifications Copyright © 2008–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: DP83848H DP83848J DP83848K DP83848M DP83848T |
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