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CDCVF310PWR Datasheet(PDF) 1 Page - Texas Instruments

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Part # CDCVF310PWR
Description  2.5-V TO 3.3-V HIGH-PERFORMANCE CLOCK BUFFER
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

CDCVF310PWR Datasheet(HTML) 1 Page - Texas Instruments

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1
FEATURES
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
GND
VDD
1Y0
1Y1
1Y2
GND
GND
1Y3
1Y4
VDD
1G
2Y4
CLK
VDD
VDD
2Y0
2Y1
GND
GND
2Y2
2Y3
VDD
VDD
2G
PW PACKAGE
(TOP VIEW)
APPLICATIONS
DESCRIPTION
CDCVF310
SCAS771B – AUGUST 2004 – REVISED JANUARY 2008
www.ti.com
2.5-V TO 3.3-V HIGH-PERFORMANCE CLOCK BUFFER
• High-Performance 1:10 Clock Driver
• Pin-to-Pin Skew < 100 ps at V
DD 3.3 V
• V
DD Range = 2.3 V to 3.6 V
• Input Clock Up To 200 MHz (See Figure 7)
• Operating Temperature Range –40°C to 85°C
• Output Enable Glitch Suppression
• Distributes One Clock Input to Two Banks of
Five Outputs
• Packaged in 24-Pin TSSOP
• Pin-to-Pin Compatible to the CDCVF2310,
Except the R = 22-
Ω Series Damping
Resistors at Yn
• General-Purpose Applications
The CDCVF310 is a high-performance, low-skew clock buffer that operates up to 200 MHz. Two banks of five
outputs each provide low-skew copies of CLK. After power up, the default state of the outputs is low regardless
of the state of the control pins. For normal operation, the outputs of bank 1Y[0:4] or 2Y[0:4] can be placed in a
low state when the control pins (1G or 2G, respectively) are held low and a negative clock edge is detected on
the CLK input. The outputs of bank 1Y[0:4] or 2Y[0:4] can be switched into the buffer mode when the control pins
(1G and 2G) are held high and a negative clock edge is detected on the CLK input. The device operates in a
2.5-V and 3.3-V environment. The built-in output enable glitch suppression ensures a synchronized output enable
sequence to distribute full period clock signals.
The CDCVF310 is characterized for operation from –40C to 85C.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2004–2008, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.


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