DS125BR111

SNLS430C – OCTOBER 2012 – REVISED AUGUST 2014

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply Voltage (VDD - 2.5 V)

-0.5

+2.75

V

Supply Voltage (VIN - 3.3 V)

-0.5

+4.0

V

LVCMOS Input/Output Voltage

-0.5

+4.0

V

CML Input Voltage

-0.5

VDD + 0.5

V

CML Input Current

-30

+30

mA

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 Handling Ratings

MIN

MAX

UNIT

Storage temperature range

-40

125

°C

260

°C

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

-5000

5000

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification

-1250

1250

(1)

For soldering specifications: See application note SNOA549.

(2)

JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process.

(3)

JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply Voltage (2.5 V mode)

2.375

2.5

2.625

V

Supply Voltage (3.3 V mode)

3.0

3.3

3.6

V

Ambient Temperature

-40

25

+85

°C

SMBus (SDA, SCL)

3.6

V

100

mVp-p

(1)

Allowed supply noise (mVp-p sine wave) under typical conditions.

7.4 Thermal Information

DS125BR111

RTW

UNIT

24 PINS

Junction-to-ambient thermal resistance

35.0

Junction-to-case (top) thermal resistance

34.0

Junction-to-board thermal resistance

13.4

°C/W

Junction-to-top characterization parameter

0.3

Junction-to-board characterization parameter

13.4

Junction-to-case (bottom) thermal resistance

3.3

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6

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