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593D107X9010D2W Datasheet(PDF) 9 Page - Vishay Siliconix |
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593D107X9010D2W Datasheet(HTML) 9 Page - Vishay Siliconix |
9 / 11 page www.vishay.com 35 593D Vishay Sprague Document Number 40005 Revision 01-Mar-04 For technical questions, contact tantalum@vishay.com 5. Power Dissipation: Power dissipation will be affected by the heat sinking capability of the Temperature Derating Factor + 25°C + 85°C + 125°C 1.0 0.9 0.4 1. A-C Ripple Current: The maximum allowable ripple current shall be determined from the formula: where, P = Power Dissipation in Watts @ + 25°C as given in the table in Paragraph Number 5 (Power Dissipation). RESR = The capacitor Equivalent Series Resistance at the specified frequency. 2. A-C Ripple Voltage: The maximum allowable ripple voltage shall be determined from the formula: or, from the formula: where, P = Power Dissipation in Watts @ + 25°C as given in the table in Paragraph Number 5 (Power Dissipation). RESR = The capacitor Equivalent Series Resistance at the specified frequency. Z = The capacitor impedance at the specified frequency. 2.1 The sum of the peak AC voltage plus the DC voltage shall not exceed the DC voltage rating of the capacitor. 2.2 The sum of the negative peak AC voltage plus the applied DC voltage shall not allow a voltage reversal exceeding 10% of the DC rating at + 25°C. 3. Reverse Voltage: These capacitors are capable of withstanding peak voltages in the reverse direction equal to 10% of the DC rating at + 25°C, 5% of the DC rating at + 85°C and 1% of the DC rating at +125°C. 4. Temperature Derating: If these capacitors are to be operated at temperatures above + 25°C, the permissible rms ripple current or voltage shall be calculated using the derating factors as shown: Irms = P RESR Vrms = Irms x Z P RESR Vrms = Z Case Code Maximum Permissible Power Dissipation @ + 25 °C (Watts) in free air A B C D E 0.075 0.085 0.110 0.150 0.165 6. Printed Circuit Board Materials: Type 593D capacitors are compatible with commonly used printed circuit board materials (alumina substrates, FR4, FR5, G10, PTFE-fluorocarbon and porcelanized steel). 7. Attachment: 7.1 Solder Paste: The recommended thickness of the solder paste after application is .007" ± .001" [.178mm ± .025mm]. Care should be exercised in selecting the solder paste. The metal purity should be as high as practical. The flux (in the paste) must be active enough to remove the oxides formed on the metallization prior to the exposure to soldering heat. In practice this can be aided by extending the solder preheat time at temperatures below the liquidous state of the solder. 7.2 Soldering: Capacitors can be attached by conventional soldering techniques - vapor phase, infrared reflow, wave soldering and hot plate methods. The Soldering Profile chart shows maximum recomended time/temperature conditions for solder- ing. Attachment with a soldering iron is not recom- mended due to the difficulty of controlling temperature and time at temperature. 8. Cleaning (Flux Removal) After Soldering: The 593D is compatible with all commonly used solvents such as TES, TMS, Prelete, Chlorethane, Terpene and aqueous cleaning media. However, CFC/ODS products are not used in the production of these devices and are not recommended. Solvents contain- ing methylene chloride or other epoxy solvents should be avoided since these will attack the epoxy encapsulation material. 8.1 When using ultrasonic cleaning, the board may resonate if the output power is too high. This vibration can cause cracking or a decrease in the adherence of the termination. DO NOT EXCEED 9W/l @ 40kHz for 2 minutes. GUIDE TO APPLICATION mounting surface. Non-sinusoidal ripple current may produce heating effects which differ from those shown. It is important that the equivalent Irms value be established when calculating permissible operating levels. (Power Dissipation calculated using + 25°C temperature rise.) |
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