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VFP1300-G1-830-05 Datasheet(PDF) 3 Page - OSRAM GmbH |
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VFP1300-G1-830-05 Datasheet(HTML) 3 Page - OSRAM GmbH |
3 / 4 page VFP1300 – G1– 20.05.2015 Page 3 of 4 www.osram.com OSRAM APAC Installation of LED modules (with power supplies) needs to be made with regard to all applicable electrical and safety standards. Only qualified personnel should be allowed to perform installations. Observe correct polarity! Incorrect polarity will lead to no light emission and may cause damage of the LED module. Parallel connection is highly recommended as safe electrical operation mode. Serial connection is not recommended. Unbalanced voltage drop can cause hazardous overload and damage the LED module. The maximum length of VFP1300-G1 is 5M with power feed at one end. When mounting on metallic or otherwise conductive surfaces, there needs to be a electrical isolation at soldering points between module and the mounting surface, Pay attention to ESD steps when mounting the module. Please ensure that the power supply is of adequate power to operate the total load. LED modules are dimmable by means of PWM (pulse width modulation). It is recommended using the following OSRAM control gears: OPTOTRONIC® OT DIM, OT DALI DIM, OT DALI DIM LI. Damage by corrosion will not be honored as a materials defect claim. It is the user’s responsibility to provide suitable protection against corrosive agents such as moisture and condensation and other harmful elements. For applications involving exposure to humidity and dust the module must be protected by a fixture or housing with a suitable protection class. Assembly Information The smallest electrical unit (SEU) (138mm - 6 LEDs) can be removed by cutting at the printed marks at the side. After cutting connect the module via IP54 CONNECTsystem. Insert module into connector and apply pressure on a hard surface until locked. The mounting of the single LED coupons is facilitated by means of the double-sided adhesive on the back surface of the module. Care must be taken to provide a clean and dry mounting surface, free of oils or silicone coatings as well as dirt particle. The mounting substrate must have sufficient structural integrity. Take care to completely remove the adhesive backing. Once the module is appropriately positioned, press on the module with about 20N/cm²(refer to application techniques of Tesa adhesive transfer tapes). To support adhesion at higher temperatures, it’s necessary to use additional mounting brackets. The minimum bending radius is 5 cm. When installing in environments with large variations in temperature (e.g. outdoor applications) and operating length of more than 2 m, the use of adequate mounting surfaces is necessary . Otherwise it is advisable to use an additional thicker adhesive tape to absorb the stress of any mismatch in expansion. Pay attention to avoid highly corrosive atmospheres, e.g. permanent high humidity or Hydrogen Sulfide (H2S). With current LED technology, H2S is causing accelerated corrosion which will lead to shortened time life or premature failure. Sources for H2S may be rubber, foamed rubber, soft-foam-tapes, sealing on rubber basis, natural sources (e.g. sulfur springs), etc. To avoid H2S from sulfur-vulcanized rubber it is necessary to switch to silicon based materials or rubber that is Peroxid- crossl inked. Indication may be found in the material datasheet of the rubber supplier. |
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