5

DCR010503, DCR012405, DCR010505

DCR011203, DCR011205, DCR012403

www.ti.com

SBVS013D – OCTOBER 2001 – REVISED JUNE 2016

Product Folder Links: DCR010503 DCR012405 DCR010505 DCR011203 DCR011205 DCR012403

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Copyright © 2001–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

See the package option addendum at the end of the datasheet for additional package information.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Input voltage

5-V input devices

7

V

12-V input devices

15

24-V input devices

29

Lead temperature

PDIP package

Surface temperature of device body or pins

(maximum 10 s)

270

°C

Reflow solder temperature

SOP package

Surface temperature of device body or pins

260

°C

–60

125

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±1000

V

±250

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input voltage

5-V input devices

4.5

5

5.5

V

12-V input devices

10.8

12

13.2

24-V input devices

21.6

24

26.4

Operating temperature

–40

85

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

DCR01

UNIT

NVE (PDIP)

DVB (SOP)

10 PINS

12 PINS

Junction-to-ambient thermal resistance

60

60

°C/W

Junction-to-case (top) thermal resistance

26

26

°C/W

Junction-to-board thermal resistance

24

24

°C/W

Junction-to-top characterization parameter

7

7

°C/W

Junction-to-board characterization parameter

24

24

°C/W