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BQ25121YFPR Datasheet(PDF) 7 Page - Texas Instruments |
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BQ25121YFPR Datasheet(HTML) 7 Page - Texas Instruments |
7 / 68 page 7 BQ25120, BQ25121 www.ti.com SLUSBZ9B – AUGUST 2015 – REVISED MAY 2016 Product Folder Links: BQ25120 BQ25121 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 8.4 Thermal Information THERMAL METRIC(1) bq25120 UNIT YFP (DSBGA) 25 PINS RθJA Junction-to-ambient thermal resistance 60 °C/W RθJC(top) Junction-to-case (top) thermal resistance 0.3 RθJB Junction-to-board thermal resistance 12.0 ψJT Junction-to-top characterization parameter 1.2 ψJB Junction-to-board characterization parameter 12.0 RθJC(bot) Junction-to-case (bottom) thermal resistance N/A |
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