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BQ24168YFFT Datasheet(PDF) 5 Page - Texas Instruments

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Part # BQ24168YFFT
Description  Single-Cell Switched-Mode Li-Ion Battery Charger
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

BQ24168YFFT Datasheet(HTML) 5 Page - Texas Instruments

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bq24160, bq24160A, bq24161
bq24161B, bq24163, bq24168
www.ti.com
SLUSAO0G – NOVEMBER 2011 – REVISED DECEMBER 2015
Pin Functions
PIN
NO.
NO.
I/O
DESCRIPTION
bq24160, 3
bq24161, 1B, 8
NAME
YFF
RGE
YFF
RGE
BAT
G1-G4
11, 12
G1-G4
11, 12
I/O
Battery Connection – Connect to the positive terminal of the battery. Additionally, bypass BAT
to GND with at least a 1
μF capacitor.
BGATE
F5
10
F5
10
O
External Discharge MOSFET Gate Connection – BGATE drives an external P-Channel
MOSFET to provide a very low-resistance discharge path. Connect BGATE to the gate of the
external MOSFET. BGATE is low during high impedance mode and when no input is connected.
BOOT
E7
19
E7
19
I
High Side MOSFET Gate Driver Supply – Connect a 0.01µF ceramic capacitor (voltage rating
> 10V) from BOOT to SW to supply the gate drive for the high side MOSFETs.
CD
E4
24
E4
24
I
IC Hardware Chip Disable Input – Drive CD high to place the bq2416xx in high-z mode. Drive
CD low for normal operation. Do not leave CD unconnected.
D+
E2
2
I
D+ and D– Connections for USB Input Adapter Detection – When a charge cycle is initiated
by the USB input, and a short is detected between D+ and D–, the USB input current limit is set
D–
E3
1
I
to 1.5A. If a short is not detected, the USB100 mode is selected. The D+/D– detection has no
effect on the IN input.
DRV
F7
6
F7
6
O
Gate Drive Supply – DRV is the bias supply for the gate drive of the internal MOSFETs. Bypass
DRV to PGND with a 1
μF ceramic capacitor. DRV may be used to drive external loads up to
10mA. DRV is active whenever the input is connected and VSUPPLY > VUVLO and VSUPPLY > (VBAT
+ VSLP)
IN
A1- A4
21
A1- A4
21
I
Input power supply – IN is connected to the external DC supply (AC adapter or alternate power
source). Bypass IN to PGND with at least a 1
μF ceramic capacitor.
INT
F6
7
F6
7
O
Status Output – INT is an open-drain output that signals charging status and fault interrupts.
INT pulls low during charging. INT is high impedance when charging is complete or the charger
is disabled. When a fault occurs, a 128
μs pulse is sent out as an interrupt for the host. INT is
enabled/disabled using the EN_STAT bit in the control register. Connect INT to a logic rail
through a 100k
Ω resistor to communicate with the host processor.
PGND
D1-D7,
5, 15,
D1-D7,
5, 15,
Ground terminal – Connect to the thermal pad (for VQFN only) and the ground plane of the
circuit.
E1, G7
16, 17
E1, G7
16, 17
PMIDI
B1-B4
20
B1-B4
20
O
Reverse Blocking MOSFET and High Side MOSFET Connection Point for High Power
Input – Bypass PMIDI to GND with at least a 4.7
μF ceramic capacitor. Use caution when
connecting an external load to PMIDI. The PMIDI output is not current limited. Any short on
PMIDI will damage the IC.
PMIDU
B5-B7
23
B5-B7
23
O
Reverse Blocking MOSFET and High Side MOSFET Connection Point for USB Input –
Bypass PMIDU to GND with at least a 4.7
μF ceramic capacitor. Use caution when connecting
an external load to PMIDU. The PMIDU output is not current limited. Any short on PMIDU will
damage the IC.
PSEL
E2
2
USB Source Detection Input – Drive PSEL high to indicate that a USB source is connected to
the USB input. When PSEL is high, the IC starts up with a 100mA (bq24161/8) or 500mA
(bq24161B) input current limit for USB. Drive PSEL low to indicate that an AC Adapter is
connected to the USB input. When PSEL is low, the IC starts up with a 1.5A input current limit
for USB. PSEL has no effect on the IN input. Do not leave PSEL unconnected.
SCL
E6
3
E6
3
I
I2C Interface Clock – Connect SCL to the logic rail through a 10k
Ω resistor.
SDA
E5
4
E5
4
I/O
I2C Interface Data – Connect SDA to the logic rail through a 10k
Ω resistor.
STAT
G6
8
G6
8
O
Status Output – STAT is an open-drain output that signals charging status and fault interrupts.
STAT pulls low during charging. STAT is high impedance when charging is complete or the
charger is disabled. When a fault occurs, a 128
μs pulse is sent out as an interrupt for the host.
STAT is enabled /disabled using the EN_STAT bit in the control register. Pull STAT up to a logic
rail thruogh an LED for visual indication or through a 10k
Ω resistor to communicate with the host
processor.
SW
C1-C7
18
C1-C7
18
O
Inductor Connection – Connect to the switched side of the external inductor.
SYS
F1-F4
13, 14
F1-F4
13,14
I
System Voltage Sense and Charger FET Connection – Connect SYS to the system output at
the output bulk capacitors. Bypass SYS locally with at least 10
μF. A 47μF bypass capacitor is
recommended for optimal transient response.
TS
G5
9
G5
9
I
Battery Pack NTC Monitor – Connect TS to the center tap of a resistor divider from DRV to
GND. The NTC is connected from TS to GND. The TS function provides 4 thresholds for JEITA
compatibility (160, 161B, 163, 168 only). TS faults are reported by the I2C interface. See the
NTC Monitor section for more details on operation and selecting the resistor values. Connect TS
to DRV to disable the TS function.
USB
A5-A7
22
A5-A7
22
I
USB Input Power Supply – USB is connected to the external DC supply (AC adapter or USB
port). Bypass USB to PGND with at least a 1
μF ceramic capacitor.
Thermal
Pad
Pad
There is an internal electrical connection between the exposed thermal pad and the PGND pin
of the device. The thermal pad must be connected to the same potential as the PGND pin on the
Pad
printed circuit board. Do not use the thermal pad as the primary ground input for the device.
PGND pin must be connected to ground at all times.
Copyright © 2011–2015, Texas Instruments Incorporated
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5
Product Folder Links: bq24160 bq24160A bq24161 bq24161B bq24163 bq24168


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