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AMC7812BSRGCT Datasheet(PDF) 2 Page - Texas Instruments |
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AMC7812BSRGCT Datasheet(HTML) 2 Page - Texas Instruments |
2 / 92 page AMC7812B SBAS625A – SEPTEMBER 2013 – REVISED SEPTEMBER 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range, unless otherwise noted. VALUE UNIT AVDD to GND –0.3 to +6 V DVDD to GND –0.3 to +6 V IOVDD to GND –0.3 to +6 V AVCC to GND –0.3 to +18 V DVDD to DGND –0.3 to +6 V Analog input voltage to GND –0.3 to AVDD + 0.3 V ALARM, GPIO-0, GPIO-1, GPIO-2, GPIO-3, SCLK/SCL, and SDI/SDA to GND –0.3 to +6 V D1+/GPIO-4, D1–/GPIO-5, D2+/GPIO-6, D2–/GPIO-7 to GND –0.3 to AVDD + 0.3 V Digital input voltage to DGND –0.3 to IOVDD + 0.3 V SDO and DAV to GND –0.3 to IOVDD + 0.3 V Operating temperature range –40 to +125 °C Storage temperature range –40 to +150 °C Junction temperature range (TJ max) +150 °C Human body model (HBM) 2.5 kV Electrostatic discharge (ESD) ratings Charged device model (CDM) 1.0 kV (1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability. THERMAL INFORMATION AMC7812B THERMAL METRIC(1) RGC (QFN) PAP (HTQFP) UNITS 64 PINS 64 PINS θJA Junction-to-ambient thermal resistance 24.1 33.7 θJCtop Junction-to-case (top) thermal resistance 8.1 9.5 θJB Junction-to-board thermal resistance 3.2 9.0 °C/W ψJT Junction-to-top characterization parameter 0.1 0.3 ψJB Junction-to-board characterization parameter 3.3 8.9 θJCbot Junction-to-case (bottom) thermal resistance 0.6 0.2 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: AMC7812B |
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