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AMC7812BSRGCT Datasheet(PDF) 2 Page - Texas Instruments

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Part # AMC7812BSRGCT
Description  12-Bit Analog Monitoring and Control Solution with Multichannel ADC, DACs, and Temperature Sensors
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

AMC7812BSRGCT Datasheet(HTML) 2 Page - Texas Instruments

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AMC7812B
SBAS625A – SEPTEMBER 2013 – REVISED SEPTEMBER 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range, unless otherwise noted.
VALUE
UNIT
AVDD to GND
–0.3 to +6
V
DVDD to GND
–0.3 to +6
V
IOVDD to GND
–0.3 to +6
V
AVCC to GND
–0.3 to +18
V
DVDD to DGND
–0.3 to +6
V
Analog input voltage to GND
–0.3 to AVDD + 0.3
V
ALARM, GPIO-0, GPIO-1, GPIO-2, GPIO-3, SCLK/SCL, and SDI/SDA to GND
–0.3 to +6
V
D1+/GPIO-4, D1–/GPIO-5, D2+/GPIO-6, D2–/GPIO-7 to GND
–0.3 to AVDD + 0.3
V
Digital input voltage to DGND
–0.3 to IOVDD + 0.3
V
SDO and DAV to GND
–0.3 to IOVDD + 0.3
V
Operating temperature range
–40 to +125
°C
Storage temperature range
–40 to +150
°C
Junction temperature range (TJ max)
+150
°C
Human body model (HBM)
2.5
kV
Electrostatic discharge (ESD)
ratings
Charged device model (CDM)
1.0
kV
(1)
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
THERMAL INFORMATION
AMC7812B
THERMAL METRIC(1)
RGC (QFN)
PAP (HTQFP)
UNITS
64 PINS
64 PINS
θJA
Junction-to-ambient thermal resistance
24.1
33.7
θJCtop
Junction-to-case (top) thermal resistance
8.1
9.5
θJB
Junction-to-board thermal resistance
3.2
9.0
°C/W
ψJT
Junction-to-top characterization parameter
0.1
0.3
ψJB
Junction-to-board characterization parameter
3.3
8.9
θJCbot
Junction-to-case (bottom) thermal resistance
0.6
0.2
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
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Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: AMC7812B


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