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ADS7854IRTER Datasheet(PDF) 5 Page - Texas Instruments |
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ADS7854IRTER Datasheet(HTML) 5 Page - Texas Instruments |
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5 / 69 page  ADS8354, ADS7854, ADS7254 www.ti.com SBAS556B – OCTOBER 2013 – REVISED AUGUST 2014 7 Specifications 7.1 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT AVDD to REFGND_x or DVDD to GND –0.3 6 V Analog (AINP_x and AINM_x) and reference input (REFIO_x) voltage with REFGND_x – 0.3 AVDD + 0.3 V respect to REFGND_x Digital input voltage with respect to GND GND – 0.3 DVDD + 0.3 V Ground voltage difference |REFGND_x-GND| 0.3 V Input current to any pin except supply pins ±10 mA Maximum virtual junction temperature, TJ 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 Handling Ratings MIN MAX UNIT Tstg Storage temperature range –65 150 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all –2000 2000 pins(1) V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification –500 500 JESD22-C101, all pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT AVDD Analog supply voltage 5 V DVDD Digital supply voltage 3.3 V 7.4 Thermal Information ADS8354, ADS7854, ADS7254 THERMAL METRIC(1) RTE (WQFN) PW (TSSOP) UNIT 16 PINS 16 PINS RθJA Junction-to-ambient thermal resistance 33.3 86.9 RθJC(top) Junction-to-case (top) thermal resistance 29.5 21 RθJB Junction-to-board thermal resistance 7.3 39.1 °C/W ψJT Junction-to-top characterization parameter 0.2 0.8 ψJB Junction-to-board characterization parameter 7.4 38.4 RθJC(bot) Junction-to-case (bottom) thermal resistance 0.9 N/A (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: ADS8354 ADS7854 ADS7254 |
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