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ADC12DL040 Datasheet(PDF) 10 Page - Texas Instruments

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Part # ADC12DL040
Description  210mW A/D Converter
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

ADC12DL040 Datasheet(HTML) 10 Page - Texas Instruments

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VA
AGND
To Internal Circuitry
I/O
ADC12DL040
SNAS250D – FEBRUARY 2005 – REVISED APRIL 2013
www.ti.com
AC Electrical Characteristics
Unless otherwise specified, the following specifications apply for AGND = DGND = DR GND = 0V, VA = VD = +3.0V, VDR =
+2.5V, PD = 0V, External VREF = +1.0V, fCLK = 40 MHz, fIN = 10 MHz, tr = tf = 2 ns, CL = 15 pF/pin, Duty Cycle Stabilizer On,
parallel output mode. Boldface limits apply for TJ = TMIN to TMAX: all other limits TJ = 25°C
(1) (2) (3) (4)
Typical
Limits
Units
Symbol
Parameter
Conditions
(5)
(5)
(Limits)
fCLK1
Maximum Clock Frequency
40
MHz (min)
fCLK2
Minimum Clock Frequency
10
MHz
tCH
Clock High Time
Duty Cycle Stabilizer On
12.5
5
ns (min)
tCL
Clock Low Time
Duty Cycle Stabilizer On
12.5
5
ns (min)
tr, tf
Clock Rise and Fall Times
Duty Cycle Stabilizer On
2
4
ns (max)
tCH
Clock High Time
Duty Cycle Stabilizer Off
12.5
10
ns (min)
tCL
Clock Low Time
Duty Cycle Stabilizer Off
12.5
10
ns (min)
tr, tf
Clock Rise and Fall Times
Duty Cycle Stabilizer Off
2
ns (max)
tCONV
Conversion Latency
Parallel mode
7
Clock Cycles
3.5
ns (min)
Data Output Delay after Rising Clock
tOD
Parallel mode
6.0
Edge
9.6
ns (max)
tCONV
Conversion Latency
Multiplex mode, Channel A
7.5
Clock Cycles
tCONV
Conversion Latency
Multiplex mode, Channel B
8
Clock Cycles
3.5
ns (min)
tOD
Data Output Delay after Clock Edge
Multiplex mode
6.0
9
ns (max)
tSKEW
ABb to Data Skew
±0.5
ns (max)
tAD
Aperture Delay
2
ns
tAJ
Aperture Jitter
1.2
ps rms
tDIS
Data outputs into Hi-Z Mode
10
ns
tEN
Data Outputs Active after Hi-Z Mode
10
ns
1.0 µF on pins 4, 14; 0.1 µF on pins
tPD
Power Down Mode Exit Cycle
5,6,12,13; 10 µF between pins 5, 6 and
1
µs
between pins 12, 13
(1)
The inputs are protected as shown below. Input voltage magnitudes above VA or below GND will not damage this device, provided
current is limited per Note 4 under Absolute Maximum Ratings. However, errors in the A/D conversion can occur if the input goes above
VA or below GND by more than 100 mV. As an example, if VA is +3.3V, the full-scale input voltage must be ≤+3.4V to ensure accurate
conversions.
(2)
To specify accuracy, it is required that |VA–VD| ≤ 100 mV and separate bypass capacitors are used at each power supply pin.
(3)
With the test condition for VREF = +1.0V (2VP-P differential input), the 12-bit LSB is 488 µV.
(4)
Timing specifications are tested at TTL logic levels, VIL = 0.4V for a falling edge and VIH = 2.4V for a rising edge.
(5)
Typical figures are at TJ = 25°C, and represent most likely parametric norms. Test limits are specified to TI's AOQL (Average Outgoing
Quality Level).
10
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