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DMP2033UVT-13 Datasheet(PDF) 2 Page - Diodes Incorporated |
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DMP2033UVT-13 Datasheet(HTML) 2 Page - Diodes Incorporated |
2 / 5 page DMP2033UVT Document number: DS36617 Rev. 2 - 2 2 of 5 www.diodes.com March 2014 © Diodes Incorporated DMP2033UVT Maximum Ratings (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Units Drain-Source Voltage VDSS -20 V Gate-Source Voltage VGSS ±8 V Continuous Drain Current (Note 6) Steady State TA = +25°C TA = +70°C ID -4.2 -3.4 A Pulsed Drain Current (Note 6) IDM -10 A Thermal Characteristics Characteristic Symbol Value Units Total Power Dissipation (Note 5) PD 1.2 W Thermal Resistance, Junction to Ambient (Note 5) Steady State RθJA 100 °C/W Total Power Dissipation (Note 6) PD 1.7 W Thermal Resistance, Junction to Ambient (Note 6) Steady State RθJA 74 °C/W Operating and Storage Temperature Range TJ, TSTG -55 to 150 °C Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS (Note 7) Drain-Source Breakdown Voltage BVDSS -20 ⎯ ⎯ V VGS = 0V, ID = -250µA Zero Gate Voltage Drain Current TJ = +25°C IDSS ⎯ ⎯ -1.0 µA VDS = -20V, VGS = 0V Gate-Source Leakage IGSS ⎯ ⎯ ±100 nA VGS = ±8V, VDS = 0V ON CHARACTERISTICS (Note 7) Gate Threshold Voltage VGS(th) -0.5 — -0.9 V VDS = VGS, ID = -250µA Static Drain-Source On-Resistance RDS(ON) ⎯ 45 65 mΩ VGS = -4.5V, ID = -4.2A 57 100 VGS = -2.5V, ID = -3.4A 80 200 VGS = -1.8V, ID = -2A Forward Transfer Admittance |Yfs| ⎯ 9 ⎯ S VDS = -5V, ID = -4A DYNAMIC CHARACTERISTICS (Note 8) Input Capacitance Ciss ⎯ 845 ⎯ pF VDS = -15V, VGS = 0V f = 1.0MHz Output Capacitance Coss ⎯ 72 ⎯ pF Reverse Transfer Capacitance Crss ⎯ 63 ⎯ pF SWITCHING CHARACTERISTICS (Note 8) Total Gate Charge Qg ⎯ 10.4 ⎯ nC VGS = -4.5V, VDS = -4V, ID = -3.5A Gate-Source Charge Qgs ⎯ 1.5 ⎯ nC Gate-Drain Charge Qgd ⎯ 1.9 ⎯ nC Turn-On Delay Time tD(on) ⎯ 6.5 ⎯ ns VDS = -4V, VGS = -4.5V, RG = 6Ω, ID = -1A Turn-On Rise Time tr ⎯ 13.4 ⎯ ns Turn-Off Delay Time tD(off) ⎯ 51.5 ⎯ ns Turn-Off Fall Time tf ⎯ 21.8 ⎯ ns Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout. 6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate. 7. Short duration pulse test used to minimize self-heating effect. 8. Guaranteed by design. Not subject to product testing. |
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