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CG0603MLU-24E Datasheet(PDF) 2 Page - Bourns Electronic Solutions |
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CG0603MLU-24E Datasheet(HTML) 2 Page - Bourns Electronic Solutions |
2 / 3 page Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. ChipGuard® MLU Series - ESD Protectors Product Dimensions CG0402 CG0603 Dimension Series Series L 1.00 ± 0.15 1.60 ± 0.20 (0.04 ± 0.006) (0.064 ± 0.008) W 0.50 ± 0.10 0.80 ± 0.20 (0.02 ± 0.004) (0.032 ± 0.008) A 0.36 ± 0.05 0.45 ± 0.10 (0.014 ± 0.002) (0.018 ± 0.004) B 0.25 ± 0.15 0.30 ± 0.20 (0.10 ± 0.006) (0.012 ± 0.008) DIMENSIONS: MM (INCHES) Recommended Pad Layout L W B A A C B D CG0402 CG0603 Dim. Series Series A 0.51 0.76 (0.020) (0.030) B 0.61 1.02 (0.024) (0.040) C 0.51 0.50 (0.020) (0.020) D 1.70 2.54 (0.067) (0.100) Solder Reflow Recommendations 110 sec. (min.) 300 250 200 150 100 50 0 30-70 sec. 120 sec. (min.) Preheat Stages 1-3 Soldering Cooling Time (seconds) • This product can be damaged by rapid heating, cooling or localized heating. • Heat shocks should be avoided. Preheating and gradual cooling recommended. • Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended. • Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds. A solder gun under 30 watts is recommended. A Stage 1 Preheat Ambient to Preheating 30 s to 60 s Temperature B Stage 2 Preheat 140 °C to 160 °C 60 s to 120 s C Stage 3 Preheat Preheat to 200 °C 20 s to 40 s D Main Heating 200 °C 60 s to 70 s 210 °C 55 s to 65 s 220 °C 50 s to 60 s 230 °C 40 s to 50 s 240 °C 30 s to 40 s E Cooling 200 °C to 100 °C 1 °C/s to 4 °C/s |
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