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NE57811 Datasheet(PDF) 4 Page - NXP Semiconductors

Part # NE57811
Description  Advanced DDR memory termination power with shutdown
Download  13 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

NE57811 Datasheet(HTML) 4 Page - NXP Semiconductors

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Philips Semiconductors
Product data
NE57811
Advanced DDR memory termination power
with shutdown
2003 Apr 02
4
ELECTRICAL CHARACTERISTICS
Tamb = 0 °C to +70 °C, VDD = 2.5 V; ITT = –3.5 A to +3.5 A, unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VTT
Output voltage
VDD/2
V
VACC
Output voltage accuracy (Note 4)
ITT = 0 A
–15
+15
mV
VDD
Supply voltage
1.6
3.6
V
IQ(op)
Supply current
ITT = 0 A
14
30
mA
IQ(SD)
Standby quiescent current
Standby asserted
1.2
1.35
mA
ITT
Output current
VDD = 2.5 V ≤ VDD ≤ 3.6 V
–3.5
+3.5
A
VDD = 1.6 V
–2.5
+2.5
A
∆VTT
Load regulation
ITT = ±1.0 A
±6
mV
ITT = ±3.5 A
–18
+18
mV
CLOAD
Load capacitance (Note 2)
Stable operation
100
µF
Reference Out
RefOut
Voltage reference out (Note 3)
IrefOut = 0 A; source or sink
–15
VDD/2
+15
mV
IrefOut
Reference Out current max
2.2
3
mA
CLOAD
Load capacitance
Stable operation
0.1
µF
Power Stage
Ilim
Current limit
3.6
4.5
5.6
A
Tlim
Temperature shutdown
+150
°C
Temperature shutdown hysteresis
20
°C
NOTES:
1. Limits are 100% production tested at 25
°C. Limits over the operating temperature range are guaranteed through correlation using Statistical
Quality Control (SQC) methods.
2. Ceramic capacitors only. Low ESR electrolytic capacitors are not necessary.
3. RefOut voltage referenced to 1/2 VDD.
4. VACC = VTT – VDD/2.


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