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LDBCC2824JC5N0 Datasheet(PDF) 8 Page - Kemet Corporation

Part # LDBCC2824JC5N0
Description  LDB Series Unencapsulated Stacked Chip, Size 1206 ??1812, 16 and 50 VDC
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Manufacturer  KEMET [Kemet Corporation]
Direct Link  http://www.kemet.com
Logo KEMET - Kemet Corporation

LDBCC2824JC5N0 Datasheet(HTML) 8 Page - Kemet Corporation

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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
F3082_LDB • 5/20/2015
8
Surface Mount Metallized PPS Film Capacitors
LDB Series Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC
Flux/Cleaning/Storage and Moisture cont'd
Storage and moisture recommendations
KEMET SMD Film Capacitors are supplied in a MBB (Moisture Barrier Bag) Class 1. We can guarantee a 24 months shelf life
(temperature≤40°C/relativehumidity≤90%).AftertheMBBhasbeenopened,componentsmaystayinareaswithcontrolled
temperatureandhumidity(temperature≤30°C/relativehumidity≤60%)for168hours[MSL3](ratedvoltage≤100VDC)or696hours
[MSL2a](ratedvoltage>100VDC).Forlongerperiodsoftimeand/orhighertemperatureand/orhigherrelativehumidityvalues,it
is absolutely necessary to protect the components against humidity. If the reel inside the MBB is partially used, KEMET recommends
to re-use the same MBB or to avoid areas without controlled temperature and humidity (see above). If the above conditions are not
respected,componentsrequireabaking(minimumtime:48hoursat55±5°C)beforethereflow.
Manual assembly recommendations
If PCBs are assembled manually, care must be taken to avoid any mechanical damage to the
components. Our recommendations are the following (see Fig. 1):
1. When using tweezers, the components should be gripped across the two terminations (A);
2. Avoid any contact with the two cutting surfaces (C);
3. A vacuum pen is recommended on the top and bottom surfaces (B).
Manual soldering recommendations
LDEandLDBserieshavebeendesignedforSurfaceMountTechnology,pick&placemachinesandreflowsolderingsystems.Usinga
manual soldering iron, issues may occur because the typical temperature for manual soldering is around 350°C. Therefore please pay
careful attention:
• Never touch the capacitor body with the soldering iron but rather touch the soldering iron and the end termination with the tin wire
edge (see Fig. 2);
• If the soldering iron is equipped with a temperature controller device:
Set the temperature to 250 ± 3°C and proceed as per Fig. 2 (the maximum soldering time, on both terminations, is 5 seconds);
• If the soldering iron is NOT equipped with a temperature controller device:
This is the worst situation. The following are a few practical suggestions but, clearly, the operator’s experience is extremely important:
1. Proceed as per Fig. 2;
2. As soon as the tin wire starts melting, move the soldering iron away as quickly as possible;
3. Wait a few seconds and check that the soldering joint has been properly created;
• Ifthesolderingironisequippedwithahotairflowdevice:
Set the hot air temperature to 250 ± 3°C and do not send the hot air directly onto the capacitor plastic body. In this situation, the
operator’s experience is very important;
• In any case, avoid mass-mounting SMD Film Capacitors manually.


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