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CPC1927 Datasheet(PDF) 1 Page - IXYS Corporation

Part # CPC1927
Description  Low Drive Power Requirements
Download  7 Pages
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Manufacturer  IXYS [IXYS Corporation]
Direct Link  http://www.ixys.com
Logo IXYS - IXYS Corporation

CPC1927 Datasheet(HTML) 1 Page - IXYS Corporation

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INTEGRATED CIRCUITS DIVISION
DS-CPC1927-R06
www.ixysic.com
1
e3
Characteristics
Features
6.7A
rms Load Current with 5°C/W Heat Sink
Low 0.2
 On-Resistance
250V
P Blocking Voltage
2500V
rms Input/Output Isolation
Low Thermal Resistance:
JC = 0.3 °C/W
Isolated, Low Thermal Impedance Ceramic Pad for
Heat Sink Applications
Low Drive Power Requirements
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Applications
Industrial Controls / Motor Control
Robotics
Medical Equipment—Patient/Equipment Isolation
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Meters (Watt-Hour, Water, Gas)
Transportation Equipment
Aerospace/Defense
Approvals
UL 508 Certified Component: File E69938
Pin Configuration
Description
IXYS Integrated Circuits Division and IXYS have
combined to bring OptoMOS® technology, reliability
and compact size to a new family of high-power Solid
State Relays.
As part of this family, the CPC1927 single-pole
normally open (1-Form-A) Solid State Power Relay is
rated for up to 6.7Arms continuous load current with a
5°C/W heat sink.
The CPC1927 employs optically coupled MOSFET
technology to provide 2500Vrms of input to output
isolation. The optically coupled outputs, that use
patented OptoMOS architecture, are controlled by a
highly efficient infrared LED. The combination of low
on-resistance and high load current handling
capability makes this relay suitable for a variety of high
performance switching applications.
The unique ISOPLUS-264 package pioneered by
IXYS enables Solid State Relays to achieve the
highest load current and power ratings. This package
features a unique IXYS process where the silicon
chips are soft soldered onto the Direct Copper Bond
(DCB) substrate instead of the traditional copper
leadframe. The DCB ceramic, the same substrate
used in high power modules, not only provides
2500Vrms isolation but also very low junction-to-case
thermal resistance (0.3 °C/W).
Ordering Information
Switching Characteristics
Parameter
Rating
Units
Blocking Voltage
250
VP
Load Current, TA=25°C:
With 5°C/W Heat Sink
6.7
Arms / ADC
No Heat Sink
2.7
On-Resistance (max)
0.2
Thermal Resistance,
Junction-to-Case,
JC
0.3
°C/W
Part
Description
CPC1927J
ISOPLUS-264 Package (25 per tube)
Form-A
I
F
I
LOAD
10%
90%
t
on
t
off
CPC1927
250V Single-Pole, Normally Open
Power Relay


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