Features

design

Applications

Characteristics

*RoHS Directive 2002/95/EC Jan. 27, 2003 including

annex and RoHS Recast 2011/65/EU June 8, 2011.

Specifications are subject to change without notice.

The device characteristics and parameters in this data

sheet can and do vary in different applications and

actual device performance may vary over time.

Users should verify actual device performance in their

specific applications.

Test Methods per ITU-T K.12, IEEE C62.31 and IEC 61643-311 GDT standards.

Characteristic

Model No.

2028-23

2028-25

2028-35

2028-42

DC Sparkover ±20 % @ 100 V/s

230 V

250 V

350 V

420 V

100 V/µs (Typical/99 %)

1000 V/µs (Typical/99 %)

< 450 V/550 V

< 650 V/750 V

< 450 V/550 V

< 650 V/750 V

< 700 V/800 V

< 850 V/950 V

< 850 V/950 V

< 1050 V/1150 V

Impulse Transverse Delay ............................... 1000 V/µs..........................................................< 75 ns

Insulation Resistance (IR) ............................... 100 V ................................................................> 1 G

Ω

Capacitance..................................................... 1 MHz ...............................................................< 2 pF

Glow Voltage ................................................... 10 mA................................................................~ 70 V

Arc Voltage ...................................................... 1 A.....................................................................~ 10 V

1 operation

20,000 A, 8/20 µs..............................................

10 operations

5,000 A, 10/350 µs............................................

1 operation

200 A, 10/1000 µs.............................................

300 operations

20 A, 10/1000 µs...............................................

1500 operations

Alternating Discharge Current ......................... 20 Arms, 1 second ............................................

10 operations

Operating Temperature...............................................................................................................

-55 to +85 °C

Climatic Category (IEC 60068-1)................................................................................................

40 / 90 / 21

An optional Switch-Grade Fail-Short device is available. The optional Fail-Short assembly will activate at a temperature of 215 °C –

217 °C to provide a high conductive path to ground in case of a thermal overload. GDTs equipped with the optional Fail-Short device

should be soldered either manually at a temperature that is below the activation temperature of the Fail-Short mechanism, or using a

selective soldering process that does not exceed 210 °C.

Notes:

to ground.

• At delivery AQL 0.65 Level II, DIN ISO 2859.

How to Order

2028 - nn - x n F LF

Model Number

Designator

Voltage (Divided by 10)

23 = 230 V

35 = 350 V

25 = 250 V

42 = 420 V

Leads

A = No Leads / Cassette Applications

C = 1.0 mm

Lead Shape

(See Product Dimension Drawings)

Fail-Short Option

Blank = Standard Product

F = With Fail-Short Mechanism

RoHS Compliancy

LF = RoHS Compliant Product

(1)

Impulse Sparkover voltage is defined as typical values of distribution.