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SN74LVC1G66 Datasheet(PDF) 2 Page - Texas Instruments |
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SN74LVC1G66 Datasheet(HTML) 2 Page - Texas Instruments |
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2 / 17 page  SN74LVC1G66 SINGLE BILATERAL ANALOG SWITCH SCES323H − JUNE 2001 − REVISED SEPTEMBER 2003 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 description/ordering information (continued) NanoStar and NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package. Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems. FUNCTION TABLE CONTROL INPUT (C) SWITCH L OFF H ON logic diagram (positive logic) B C A 1 4 2 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC (see Note 1) −0.5 V to 6.5 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input voltage range, VI (see Notes 1 and 2) −0.5 V to 6.5 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Switch I/O voltage range, VI/O (see Notes 1, 2, and 3) −0.5 V to VCC + 0.5 V . . . . . . . . . . . . . . . . . . . . . . . . . . . Control input clamp current, IIK (VI < 0) −50 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I/O port diode current, IIOK (VI/O < 0 or VI/O > VCC) ±50 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . On-state switch current, IT (VI/O = 0 to VCC) ±50 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous current through VCC or GND ±100 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package thermal impedance, θJA (see Note 4): DBV package 206 °C/W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DCK package 252 °C/W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . YEA/YZA package 154 °C/W . . . . . . . . . . . . . . . . . . . . . . . . . . . YEP/YZP package 132 °C/W . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage temperature range, Tstg −65 °C to 150°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltages are with respect to ground, unless otherwise specified. 2. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 3. This value is limited to 5.5 V maximum. 4. The package thermal impedance is calculated in accordance with JESD 51-7. |
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