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MAC7121VVF Datasheet(PDF) 7 Page - Motorola, Inc |
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MAC7121VVF Datasheet(HTML) 7 Page - Motorola, Inc |
7 / 48 page MOTOROLA MAC7100 Microcontroller Family Hardware Specifications 7 PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE ElectricalCharacteristics 3.5.1 Power Dissipation Simulation Details Comments: 1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. 2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal. 3. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal. 4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board at the center lead. For fused lead packages, the adjacent lead is used. 5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1). 6. Thermal characterization parameter indicating the temperature difference between package top and junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT. Table 7. Thermal Resistance for 100 lead 14x14 mm LQFP, 0.5 mm Pitch 1 1 100 LQFP, Case Outline: 983–02 Rating Value Unit Comments Junction to Ambient (Natural Convection) Single layer board (1s) RθJA 44 °C/W 1, 2 Junction to Ambient (Natural Convection) Four layer board (2s2p) RθJMA 34 °C/W 1, 3 Junction to Ambient (@ 200 ft./min.) Single layer board (1s) RθJMA 37 °C/W 1, 3 Junction to Ambient (@ 200 ft./min.) Four layer board (2s2p) RθJMA 29 °C/W 1, 3 Junction to Board RθJB 18 °C/W 4 Junction to Case RθJC 7°C/W 5 Junction to Package Top Natural Convection ΨJT 2°C/W 6 Table 8. Thermal Resistance for 112 lead 20x20 mm LQFP, 0.65 mm Pitch 1 1 112 LQFP, Case Outline: 987–01 Rating Value Unit Comments Junction to Ambient (Natural Convection) Single layer board (1s) RθJA 42 °C/W 1, 2 Junction to Ambient (Natural Convection) Four layer board (2s2p) RθJMA 34 °C/W 1, 3 Junction to Ambient (@ 200 ft./min.) Single layer board (1s) RθJMA 35 °C/W 1, 3 Junction to Ambient (@ 200 ft./min.) Four layer board (2s2p) RθJMA 30 °C/W 1, 3 Junction to Board RθJB 22 °C/W 4 Junction to Case RθJC 7°C/W 5 Junction to Package Top Natural Convection ΨJT 2°C/W 6 Table 9. Thermal Resistance for 144 lead 20x20 mm LQFP, 0.5 mm Pitch 1 1 144 LQFP, Case Outline: 918–03 Rating Value Unit Comments Junction to Ambient (Natural Convection) Single layer board (1s) RθJA 42 °C/W 1, 2 Junction to Ambient (Natural Convection) Four layer board (2s2p) RθJMA 34 °C/W 1, 3 Junction to Ambient (@ 200 ft./min.) Single layer board (1s) RθJMA 35 °C/W 1, 3 Junction to Ambient (@ 200 ft./min.) Four layer board (2s2p) RθJMA 30 °C/W 1, 3 Junction to Board RθJB 22 °C/W 4 Junction to Case RθJC 7°C/W 5 Junction to Package Top Natural Convection ΨJT 2°C/W 6 Table 10. Thermal Resistance for 208 lead 17x17 mm MAP, 1.0 mm Pitch 1 1 208 MAP BGA, Case Outline: 1159A-01 Rating Value Unit Comments Junction to Ambient (Natural Convection) Single layer board (1s) RθJA 46 °C/W 1, 2 Junction to Ambient (Natural Convection) Four layer board (2s2p) RθJMA 29 °C/W 1, 3 Junction to Ambient (@ 200 ft./min.) Single layer board (1s) RθJMA 38 °C/W 1, 3 Junction to Ambient (@ 200 ft./min.) Four layer board (2s2p) RθJMA 26 °C/W 1, 3 Junction to Board RθJB 19 °C/W 4 Junction to Case RθJC 7°C/W 5 Junction to Package Top Natural Convection ΨJT 2°C/W 6 Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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