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LQH3C100 Datasheet(PDF) 7 Page - Linear Technology |
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LQH3C100 Datasheet(HTML) 7 Page - Linear Technology |
7 / 8 page 7 LT1945 1945f PACKAGE DESCRIPTIO APPLICATIO S I FOR ATIO Setting the Output Voltages Set the output voltage for Switcher 1 (negative output voltage ) by choosing the appropriate values for feedback resistors R1 and R2. R VV V R OUT 1 123 123 2 210 6 = + ()− –. . • Set the output voltage for Switcher 2 (positive output voltage) by choosing the appropriate values for feedback resistors R1B and R2B (see Figure 1). RB R B V V OUT 12 123 1 =− . Diode Selection For most LT1945 applications, the Zetex ZHCS400 sur- face mount Schottky diode (0.4A, 40V) is an ideal choice. Schottky diodes, with their low forward voltage drop and fast switching speed, are the best match for the LT1945. The Motorola MBR0520, MBR0530, or MBR0540 can also be used. Many different manufacturers make equivalent parts, but make sure that the component is rated to handle at least 0.35A. Lowering Output Voltage Ripple Using low ESR capacitors will help minimize the output ripple voltage, but proper selection of the inductor and the output capacitor also plays a big role. The LT1945 pro- vides energy to the load in bursts by ramping up the inductor current, then delivering that current to the load. If too large of an inductor value or too small of a capacitor value is used, the output ripple voltage will increase because the capacitor will be slightly overcharged each burst cycle. To reduce the output ripple, increase the output capacitor value or add a 4.7pF feed-forward capaci- tor in the feedback network of the LT1945 (see the circuits in the Typical Applications section). Adding this small, inexpensive 4.7pF capacitor will greatly reduce the output voltage ripple. Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen- tation that the interconnection of its circuits as described herein will not infringe on existing patent rights. MS Package 10-Lead Plastic MSOP (Reference LTC DWG # 05-08-1661) MSOP (MS) 0402 0.53 ± 0.01 (.021 ± .006) SEATING PLANE 0.18 (.007) 1.10 (.043) MAX 0.17 – 0.27 (.007 – .011) 0.13 ± 0.05 (.005 ± .002) 0.86 (.034) REF 0.50 (.0197) TYP 12 3 45 4.88 ± 0.10 (.192 ± .004) 0.497 ± 0.076 (.0196 ± .003) REF 8 9 10 7 6 3.00 ± 0.102 (.118 ± .004) (NOTE 3) 3.00 ± 0.102 (.118 ± .004) NOTE 4 NOTE: 1. DIMENSIONS IN MILLIMETER/(INCH) 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 0.254 (.010) 0 ° – 6° TYP DETAIL “A” DETAIL “A” GAUGE PLANE 5.23 (.206) MIN 3.2 – 3.45 (.126 – .136) 0.889 ± 0.127 (.035 ± .005) RECOMMENDED SOLDER PAD LAYOUT 0.305 ± 0.038 (.0120 ± .0015) TYP 0.50 (.0197) BSC |
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