Electronic Components Datasheet Search |
|
NFM21HC105R1C3 Datasheet(PDF) 3 Page - Murata Manufacturing Co., Ltd. |
|
NFM21HC105R1C3 Datasheet(HTML) 3 Page - Murata Manufacturing Co., Ltd. |
3 / 11 page ■AEC-Q200 Murata Standard Specification and Test Methods Mechanical Performance (based on Table 2 for Tantalum & Ceramic Capacitors) AEC-Q200 Rev.C issued June 17. 2005 Murata Specification / Deviation No. Stress Test Method 3 High Temperature Exposure Unpowered 1000 hours @ T=150C (Ceramics) Measurement at 24+/-2 hours after test Meet Table D after testing. 4 Temperature Cycling 1000cycles (-55C to +125C) Measurement at 24+/-2 hours after test Meet Table A after testing. 6 Moisture Resistance t=24 hours/cycle. Note: Steps 7a & 7b not required. Unpowered. Meet Table D after testing. 7 Biased Humidity 1000hours 85C/85%RH. Note: Ceramics only Specified conditions: Rated Voltage and 1.3 to 1.5 volts. Add 100Kohm resister. Tantalums-Rated Voltage only. Measurement at 24+/-2 hours after test Meet Table D after testing. 8 Operational Life Condition D Steady State TA=125C Full rated ceramic caps Measurement at 24+/-2 hours after test conclusion. Meet Table D after testing. 9 External Visual Visual inspection No abnormalities 10 Physical Dimension Within the specified dimensions. No defects 12 Resistance to Solvents Per MIL-STD-202 Method 215 Not Applicable 13 Mechanical Shock Figure 1 of Method 213. SMD:Condition F Leaded:Condition C Meet Table C after testing. 14 Vibration 5g's for 20 minutes, 12cycles each of 3 oritentations Use 8"X5" PCB, .031"thick. 7 secure points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2" from any secure point. Test from 10-2000Hz. Meet Table C after testing. 15 Resistance to Soldering Heat Note: Condition B No pre-heat of samples. Note:Single Wave Solder-Procedure 2 for SMD. Procedure 1 for Leaded with solder within 1.5mm of device body. Meet Table A after testing. Deviation for AEC-Q200; Testing condition Flux: Ethanol solution of rosin, 25(wt)% Pre-heating: 150C+/-10C, 60 to 90s Solder: Sn-3.0Ag-0.5Cu Solder Temperature: 270C+/-5C Immesion Time: 10s+/-1s Immesion and emersion rates: 25mm/s Then measured after exposure in the room 16 Thermal Shock -55C/+125C Note: Number of cycles required-300, Maximum transfer time-20 s, Dwell time-15 minuites. Air-Air. Meet Table A after testing. 17 ESD Per AEC-Q200-002 Component Classification:Meet Table E 18 Solderability Per J-STD-002 95% of the terminations is to be soldered. Method B : Not Applicable 19 Electrical Characterization Summary to show Min, Max, Mean and Standard deviation at room as well as Min and Max operating temperatures. Deviation for AEC-Q200; Shown in Rated value. AEC-Q200 45 R340 F Deflection 45 Product Pressure jig JEMCPS-03093 3 |
Similar Part No. - NFM21HC105R1C3 |
|
Similar Description - NFM21HC105R1C3 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.COM |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |