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DMG3407SSN Datasheet(PDF) 2 Page - Diodes Incorporated |
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DMG3407SSN Datasheet(HTML) 2 Page - Diodes Incorporated |
2 / 6 page DMG3407SSN Document number: DS35135 Rev. 5 - 2 2 of 6 www.diodes.com April 2012 © Diodes Incorporated DMG3407SSN Maximum Ratings @TA = 25°C unless otherwise specified Characteristic Symbol Value Units Drain-Source Voltage VDSS -30 V Gate-Source Voltage VGSS ±20 V Continuous Drain Current (Note 5) VGS = -10V Steady State TA = 25°C TA = 70°C ID -4.0 -3.2 A t<10s TA = 25°C TA = 70°C ID -4.6 -3.6 A Continuous Drain Current (Note 5) VGS = -4.5V Steady State TA = 25°C TA = 70°C ID -3.3 -2.6 A t<10s TA = 25°C TA = 70°C ID -3.9 -3.1 A Pulsed Drain Current (10 μs pulse, duty cycle = 1%) IDM -30 A Maximum Body Diode Forward Current (Note 5) IS -2.0 A Thermal Characteristics @TA = 25°C unless otherwise specified Characteristic Symbol Value Units Total Power Dissipation (Note 4) TA = 25°C PD 1.1 W TA = 70°C 0.7 Thermal Resistance, Junction to Ambient (Note 4) Steady state RθJA 166 °C/W t<10s 118 Total Power Dissipation (Note 5) TA = 25°C PD 1.8 W TA = 70°C 1.1 Thermal Resistance, Junction to Ambient (Note 5) Steady state RθJA 98 °C/W t<10s 71 Thermal Resistance, Junction to Case (Note 5) RθJC 18 Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C Electrical Characteristics @ TA = 25°C unless otherwise stated Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS (Note 6) Drain-Source Breakdown Voltage BVDSS -30 - - V VGS = 0V, ID = -250μA Zero Gate Voltage Drain Current TJ = 25°C IDSS - - -1 μA VDS = -30V, VGS = 0V Gate-Source Leakage IGSS - - ±100 nA VGS = ±20V, VDS = 0V ON CHARACTERISTICS (Note 6) Gate Threshold Voltage VGS(th) -1.0 -1.5 -2.1 V VDS = VGS, ID = -250μA Static Drain-Source On-Resistance RDS (ON) - 39 50 mΩ VGS = -10V, ID = -4.1A - 56 72 VGS = -4.5V, ID = -3.0A Forward Transfer Admittance |Yfs| - 8.2 - S VDS = -5V, ID = -4A Diode Forward Voltage VSD - -0.75 -1.1 V VGS = 0V, IS = -1A DYNAMIC CHARACTERISTICS (Note 7) Input Capacitance Ciss 466 582 700 pF VDS = -15V, VGS = 0V, f = 1.0MHz Output Capacitance Coss 80 114 148 Reverse Transfer Capacitance Crss 47 76 105 Gate Resistance Rg 2 5 8 Ω VDS = 0V, VGS = 0V, f = 1MHz Total Gate Charge Qg 10.6 13.3 16 nC VGS = -10V, VDS = -15V, ID = -4A Total Gate Charge Qg 5.2 6.5 8.5 VGS = -4.5V, VDS = -15V,ID = -4A Gate-Source Charge Qgs 1.3 1.7 2 Gate-Drain Charge Qgd 1.1 1.9 2.7 Turn-On Delay Time tD(on) - 6.0 - ns VGS = -10V, VDS = -15V, RL = 3.6Ω, RG = 3Ω Turn-On Rise Time tr - 12.9 - Turn-Off Delay Time tD(off) - 35.4 - Turn-Off Fall Time tf - 30.7 - Reverse Recovery Time trr 6.8 8.5 10.2 ns IF = 4A, di/dt = 100A/μs Reverse Recovery Charge Qrr 5.5 7.0 8.5 nC Notes: 4. Device mounted on FR-4 PCB with minimum recommended pad layout, single sided. The power dissipation PD is based on t<10s RθJA 5. Device mounted on 1” x 1” FR-4 PCB with high coverage 2 oz. Copper, single sided. The power dissipation PD is based on t<10s RθJA 6. Short duration pulse test used to minimize self-heating effect. 7. Guaranteed by design. Not subject to production testing. |
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