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C1206G225K5RACT250 Datasheet(PDF) 10 Page - Kemet Corporation |
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C1206G225K5RACT250 Datasheet(HTML) 10 Page - Kemet Corporation |
10 / 22 page © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1075_X7R_HT_SMD • 3/30/2015 10 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade) Soldering Process Recommended Soldering Technique: • Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 • All other EIA case sizes are limited to solder reflow only Recommended Reflow Soldering Profile: KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions. Profile Feature Termination Finish 100% Matte Sn Preheat/Soak Temperature Minimum (TSmin) 150°C Temperature Maximum (TSmax) 200°C Time (tS) from TSmin to TSmax 60 – 120 seconds Ramp-Up Rate (TL to TP) 3°C/second maximum Liquidous Temperature (TL) 217°C Time Above Liquidous (tL) 60 – 150 seconds Peak Temperature (TP) 260°C Time Within 5°C of Maximum Peak Temperature (tP) 30 seconds maximum Ramp-Down Rate (TP to TL) 6°C/second maximum Time 25°C to Peak Temperature 8 minutes maximum Note 1: All temperatures refer to the center of the package, measured on the capacitor body surface that is facing up during assembly reflow. Time Tsmin 25° C to Peak tL tS 25 tP Tsmax TL TP Maximum Ramp Up Rate = 3°C/sec Maximum Ramp Down Rate = 6°C/sec |
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