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C0805C104J3JACTU Datasheet(PDF) 11 Page - Kemet Corporation |
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C0805C104J3JACTU Datasheet(HTML) 11 Page - Kemet Corporation |
11 / 20 page © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1086_U2J • 6/7/2016 11 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – U2J Dielectric, 10 - 50 VDC (Commercial Grade) Table 4 – Performance & Reliability: Test Methods and Conditions Stress Reference Test or Inspection Method Terminal Strength JIS–C–6429 Appendix 1, Note: Board Flex JIS–C–6429 Appendix 2, Note: 3.0 mm (minimum). Solderability J–STD–002 Magnification50XConditions: a)MethodB,4hoursat155°C,dryheatat235°C b)MethodBat215°Ccategory3 c)MethodD,category3at260°C Temperature Cycling JESD22 Method JA-104 1,000cycles(−55°Cto+125°C).Measurementat24hours+/−4hoursaftertestconclusion. Biased Humidity MIL-STD-202 Method 103 LoadHumidity:1,000hours85°C/85%RHandratedvoltage.Add100Kohmresistor.Measurement at24hours+/−4hoursaftertestconclusion. LowVoltHumidity:1,000hours85C°/85%RHand1.5V.Add100Kohmresistor.Measurementat 24hours+/−4hoursaftertestconclusion. Moisture Resistance MIL-STD-202 Method 106 t=24hours/cycle.Steps7a&7bnotrequired.Measurementat24hrs.+/−4hoursaftertest conclusion. Thermal Shock MIL-STD-202 Method 107 −55°C/+125°C.Note:Numberofcyclesrequired–300.Maximumtransfertime–20seconds.Dwell time – 15 minutes. Air – Air. High Temperature Life MIL-STD-202 Method 108/EIA -198 1,000hoursat125°Cwith2Xratedvoltageapplied. Storage Life MIL-STD-202 Method 108 125°C,0VDCfor1,000hours. Vibration MIL-STD-202 Method 204 5 G's for 20 minutes, 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7 secure points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2" from any secure point. Test from 10 – 2,000 Hz Mechanical Shock MIL-STD-202 Method 213 Figure 1 of Method 213, Condition F. Resistance to Solvents MIL-STD-202 Method 215 Add aqueous wash chemical, OKEM clean or equivalent. Storage and Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may increase.KEMETrecommendsthatmaximumstoragetemperaturenotexceed40ºCandmaximumstoragehumiditynotexceed70% relativehumidity.Temperaturefluctuationsshouldbeminimizedtoavoidcondensationonthepartsandatmospheresshouldbefreeof chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of receipt. Package Size (L" x W") Force Duration 0402 5 N (0.51 kg) 60 seconds 0603 10 N (1.02 kg) ≥0805 18 N (1.83 kg) Preliminary Data Sheet |
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