NCV7321

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2

RECOMMENDED OPERATING RANGES AND KEY TECHNICAL CHARACTERISTICS

Table 1. RECOMMENDED OPERATING RANGES AND KEY TECHNICAL CHARACTERISTICS

Symbol

Parameter

Min

Typ

Max

Unit

Nominal Battery Operating Voltage (Note 1)

5

12

27

V

Load Dump Protection

45

Supply Current in Sleep Mode

20

mA

LIN Bus Voltage

−45

45

V

Operating DC Voltage on WAKE Pin

0

V

Maximum Rating Voltage on WAKE Pin

−35

45

V

Operating DC Voltage on INH Pin

0

V

V_Dig_IO

Operating DC Voltage on Digital IO Pins (EN, RxD, TxD)

0

5.5

V

Junction Thermal Shutdown Temperature

150

165

185

°C

Operating Ambient Temperature

−40

+125

°C

Electrostatic Discharge Voltage (all pins) Human Body Model (Note 2)

−4

+4

kV

Version NCV7321D11/D12/MW2; no filter on LIN

Electrostatic Discharge Voltage (LIN) System Human Body Model (Note 3)

−10

+10

kV

Version NCV7321D12/MW2;

Voltage transients (DCC method), pin LIN

According to SAE J2962−1, Class C (Note 4)

−85

+85

V

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond

the Recommended Operating Ranges limits may affect device reliability.

(LIN pin toggling) but parameters cannot be guaranteed. For higher battery voltage operation above 27 V, LIN pull−up resistor must be

selected large enough to avoid clamping of LIN pin by voltage drop over external pull−up resistor and LIN pin min current limitation.

2. Equivalent to discharging a 100 pF capacitor through a 1.5 k

W resistor conform to MIL STD 883 method 3015.7.

3. Equivalent to discharging a 150 pF capacitor through a 330

W resistor. System HBM levels are verified by an external test−house.

4. Direct Capacitor Coupling (DCC) method according to SAE J2962−1 specification, referring to ISO 7637−3 Slow Transient Pulse. Coupling

Capacitor 10 nF. Tested with no external protections. Verified by an external test house.

Table 2. THERMAL CHARACTERISTICS

Parameter

Symbol

Value

Unit

Thermal characteristics, SOIC−8 (Note 5)

Thermal Resistance Junction−to−Air, Free air, 1S0P PCB (Note 6)

Thermal Resistance Junction−to−Air, Free air, 2S2P PCB (Note 7)

125

75

°C/W

°C/W

Thermal characteristics, DFN8 (Note 5)

Thermal Resistance Junction−to−Air, Free air, 1S0P PCB (Note 6)

Thermal Resistance Junction−to−Air, Free air, 2S2P PCB (Note 7)

140

47

°C/W

°C/W

5. Refer to ELECTRICAL CHARACTERISTICS, RECOMMENDED OPERATING RANGES and/or APPLICATION INFORMATION for Safe

Operating parameters.

6. Values based on test board according to EIA/JEDEC Standard JESD51−3, signal layer with 10% trace coverage.

7. Values based on test board according to EIA/JEDEC Standard JESD51−7, signal layers with 10% trace coverage.