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SED1565D2B Datasheet(PDF) 6 Page - Epson Company |
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SED1565D2B Datasheet(HTML) 6 Page - Epson Company |
6 / 87 page SED1565 Series 8–4 EPSON Chip Size 10.82 mm × 2.81 mm Bump Pitch 71 µm (Min.) Bump Size PAD No. 1~24 85 µm × 85 µm PAD No. 25~82 64 µm × 85 µm PAD No. 83~99 85 µm × 85 µm PAD No. 100 85 µm × 73 µm PAD No. 101~133 85 µm × 47 µm PAD No. 134 85 µm × 73 µm PAD No. 135 73 µm × 85 µm PAD No. 136~273 47 µm × 85 µm PAD No. 274 73 µm × 85 µm PAD No. 275 85 µm × 73 µm PAD No. 276~308 85 µm × 47 µm PAD No. 309 85 µm × 73 µm Bump Height 17 µm (Typ.) Chip Thickness 625 µm SED1565 Series (0, 0) 100 99 1 135 274 134 309 275 Die No. PIN DIMENSIONS |
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