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NCP1612A2DR2G Datasheet(PDF) 4 Page - ON Semiconductor |
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NCP1612A2DR2G Datasheet(HTML) 4 Page - ON Semiconductor |
4 / 33 page NCP1612A, NCP1612B, NCP1612A1, NCP1612A2, NCP1612A3, NCP1612B2 www.onsemi.com 4 Table 2. MAXIMUM RATINGS Symbol Pin Rating Value Unit VCC 9 Power Supply Input −0.3, +35 V FOVP 1 FOVP Pin −0.3, +10 V Feedback 2 Feedback Pin −0.3, +10 V VCONTROL 3 VCONTROL Pin (Note 1) −0.3, VCONTROLMAX V Vsense 4 Vsense Pin (Note 5) −0.3, +10 V FFcontrol 5 FFcontrol Pin −0.3, +10 V CS/ZCD 6 Input Voltage Current Injected to Pin 4 (Note 4) −0.3, +35 +5 V mA DRV 8 Driver Voltage (Note 1) Driver Current −0.3, VDRV −500, +800 V mA pfcOK 10 pfcOK Pin −0.3, VCC V PD RqJA Power Dissipation and Thermal Characteristics Maximum Power Dissipation @ TA = 70°C Thermal Resistance Junction-to-Air 550 145 mW °C/W TJ Operating Junction Temperature Range −40 to +125 °C TJmax Maximum Junction Temperature 150 °C TSmax Storage Temperature Range −65 to 150 °C TLmax Lead Temperature (Soldering, 10s) 300 °C MSL Moisture Sensitivity Level 1 − ESD Capability, Human Body Model (Note 2) > 2000 V ESD Capability, Machine Model (Note 2) > 200 V ESD Capability, Charged Device Model (Note 2) 1000 V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. “VCONTROLMAX” is the pin3 clamp voltage and “VDRV” is the DRV clamp voltage (VDRVhigh). If VCC is below VDRVhigh, “VDRV” is VCC. 2. This device(s) contains ESD protection and exceeds the following tests: Human Body Model 2000 V per JEDEC Standard JESD22−A114E Machine Model Method 200 V per JEDEC Standard JESD22−A115−A Charged Device Model Method 1000 V per JEDEC Standard JESD22−C101E 3. This device contains latch-up protection and exceeds 100 mA per JEDEC Standard JESD78. 4. Maximum CS/ZCD current that can be injected into pin6 (see Figure 2). 5. Recommended maximum Vsense voltage for optimal operation is 4.5 V. |
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