Weight: 0.04gram(approx.)

CZRM27C3V6P THRU C200P

NOTES : Mounted on epoxy-glass PCB with 3 x 3 mm Cu pads (

40um thick)

Parameter

Power Dissipation

TA=25

TL=80

Forward voltage

IF=0.2A

VALUE

0.8

2.3

1.2

300

150

100

30

180

150 / -55 to +150

Units

W

W

W

W

KW

MINI-SMA

Power Dissipation 0.8Watts

Dimensions in inches and (millimeters)

Features

Low profile surface-mount package

Case: Molded plastic MINI-SMA

Epoxy: UL 94V-0 rate flame retardant

Solderable per MIL-STD-202,

method 208 guaranteed

Low leakage current

Excellent stability

Polarity: cathode band

Mounting position: Any

Mechanical Data

Zener and surge current specification

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Surface Mount Zener Diode

Operating junction and Storage Temperature

Range

Thermal resistance junction to lead

ambient ( Note )

V

Non-repetitive peak pulse

TJ=25

power dissipation

100us square pulse

Non-repetitive peak pulse

TJ=25

power dissipation

10/1000us waveform

(

CZRM27C7V5P to C100P)

Non-repetitive peak pulse

TJ=25

power dissipation

10/1000us waveform

(

CZRM27C110P to C200P)

0.055(1.4)

0.071(1.8)

0.161(4.1)

0.146(3.7)

0.012(0.3)Typ.

0.110(2.8)

0.094(2.4)

0.055(1.4)

0.063(1.6)

0.035(0.9)Typ.

0.035(0.9)Typ.

www.comchiptech.com

COMCHIP

MDS0310010B

Page 1