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© 1998 Silicon Storage Technology, Inc.

326-10 12/98

2 Megabit Multi-Purpose Flash

SST39SF020

Preliminary Specifications

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Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum Stress

Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device

at these conditions or conditions greater than those defined in the operational sections of this data sheet is not implied.

Exposure to absolute maximum stress rating conditions may affect device reliability.)

Temperature Under Bias ................................................................................................................. -55°C to +125°C

Storage Temperature ...................................................................................................................... -65°C to +150°C

Package Power Dissipation Capability (Ta = 25°C) ........................................................................................... 1.0W

Through Hole Lead Soldering Temperature (10 Seconds) .............................................................................. 300°C

Surface Mount Lead Soldering Temperature (3 Seconds) ............................................................................... 240°C

Input Rise/Fall Time ......... 10 ns

See Figures 12 and 13

Range

Ambient Temp

Commercial

0 °C to +70 °C

5V±10%

Industrial

-40 °C to +85 °C

5V±10%