UCC27323, UCC27324, UCC27325

UCC37323, UCC37324, UCC37325

SLUS492B – JUNE 2001 – REVISED SEPTEMBER 2002

2

www.ti.com

ORDERING INFORMATION

OUTPUT

TEMPERATURE RANGE

PACKAGED DEVICES

OUTPUT

CONFIGURATION

TEMPERATURE RANGE

TA = TJ

SOIC-8 (D)

MSOP-8 PowerPAD

(DGN)

}

PDIP-8 (P)

Dual inverting

–40

°C to +85°C

UCC27323D

UCC27323DGN

UCC27323P

Dual inverting

0

°C to +70°C

UCC37323D

UCC37323DGN

UCC37323P

D al nonIn erting

–40

°C to +85°C

UCC27324D

UCC27324DGN

UCC27324P

Dual nonInverting

0

°C to +70°C

UCC37324D

UCC37324DGN

UCC37324P

One inverting,

–40

°C to +85°C

UCC27325D

UCC27325DGN

UCC27325P

One inverting,

one noninverting

0

°C to +70°C

UCC37325D

UCC37325DGN

UCC37325P

† D (SOIC–8) and DGN (PowerPAD–MSOP) packages are available taped and reeled. Add R suffix to device type (e.g. UCC27323DR,

UCC27324DGNR) to order quantities of 2,500 devices per reel for D or 1,000 devices per reel for DGN package.

‡ The PowerPAD

is the ground of the device.

D, DGN, OR P PACKAGE

(TOP VIEW)

VDD

OUTA

N/A

OUTB

INA

N/A

GND

INB

1

2

3

4

8

7

6

5

D, DGN, OR P PACKAGE

(TOP VIEW)

VDD

OUTA

N/A

OUTB

INA

N/A

GND

INB

1

2

3

4

8

7

6

5

D, DGN, OR P PACKAGE

(TOP VIEW)

VDD

OUTA

N/A

OUTB

INA

N/A

GND

INB

1

2

3

4

8

7

6

5

(DUAL INVERTING)

(DUAL NONINVERTING)

(ONE INVERTING,

ONE NONINVERTING)

power dissipation rating table

PACKAGE

SUFFIX

Θjc (°C/W)

Θja (°C/W)

Power Rating (mW)

TA = 70°C See Note 1

Derating Factor Above

70

°C (mW/ C) See

Note 1

SOIC-8

D

42

84 – 160

}

344–655 See Note 2

6.25 – 11.9 See Note 2

PDIP-8

P

49

110

500

9

MSOP PowerPAD-8

See Note 3

DGN

4.7

50 – 59

}

1370

17.1

Notes: 1. 125

°C operating junction temperature is used for power rating calculations

2. The range of values indicates the effect of pc–board. These values are intended to give the system designer an indication of the

best and worst case conditions. In general, the system designer should attempt to use larger traces on the pc–board where possible

in order to spread the heat away form the device more effectively. For information on the PowerPAD

t package, refer to Technical

Brief, PowerPad Thermally Enhanced Package, Texas Instrument s Literature No. SLMA002 and Application Brief, PowerPad Made

Easy, Texas Instruments Literature No. SLMA004.

3. The PowerPAD

substrate which is the ground of the device.

Table 1. Input/Output Table

INPUTS (VIN_L, VIN_H)

UCC37323

UCC37324

UCC37325

INA

INB

OUTA

OUTB

OUTA

OUTB

OUTA

OUTB

L

L

H

H

L

L

H

L

L

H

H

L

L

H

H

H

H

L

L

H

H

L

L

L

H

H

L

L

H

H

L

H