ADG819BRM datasheet(4/12 Pages) AD

Part #	ADG819BRM

Description	0.5 OHM CMOS 1.8 V to 5.5 V 2:1 Mux/SPDT Switches

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Manufacturer	AD [Analog Devices]

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REV. 0

ADG819/ADG820

–4–

ABSOLUTE MAXIMUM RATINGS

1

(TA = 25

°C, unless otherwise noted.)

VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

Analog Inputs

2 . . . . . . . . . . . . . . . . . –0.3 V to V

DD + 0.3 V or

. . . . . . . . . . . . . . . . . . . . . . . 30 mA, Whichever Occurs First

Digital Inputs

2 . . . . . . . . . . . . . . . . . –0.3 V to V

DD + 0.3 V or

. . . . . . . . . . . . . . . . . . . . . . . 30 mA, Whichever Occurs First

Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . 400 mA

. . . . . . . . . . . . . . . .(Pulsed at 1 ms, 10% Duty Cycle Max)

Continuous Current, S or D . . . . . . . . . . . . . . . . . . . 200 mA

Operating Temperature Range

Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . –40

°C to +85°C

Automotive . . . . . . . . . . . . . . . . . . . . . . . . –40

°C to +125°C

Storage Temperature Range . . . . . . . . . . . . –65

°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 150

°C

µSOIC Package

JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . .

206

°C/W

JC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 44

°C/W

SOT-23 Package (4-Layer Board)

JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . .

119

°C/W

MicroCSP Package

JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . . .

TBD

Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . 300

°C

IR Reflow, Peak Temperature (<20 sec) . . . . . . . . . . . 235

°C

NOTES

1 Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability. Only one absolute

maximum rating may be applied at any one time.

2 Overvoltages at IN, S, or D will be clamped by internal diodes. Current should be

limited to the maximum ratings given.

Table I. Truth Table for the ADG819/ADG820

IN

Switch S1

Switch S2

0

ON

OFF

1

OFF

ON

PIN CONFIGURATIONS

6-Lead SOT-23

(RT-6)

TOP VIEW

(Not to Scale)

6

5

4

1

2

3

IN

S2

ADG819/

ADG820

VDD

GND

D

S1

8-Lead

µSOIC

(RM-8)

TOP VIEW

(Not to Scale)

8

7

6

5

1

2

3

4

NC = NO CONNECT

D

S2

ADG819/

ADG820

S1

VDD

GND

NC

IN

NC

2

3 MicroCSP

S2

IN

S1

VDD

D

GND

ADG819 ONLY

TOP VIEW

(BUMPS AT THE BOTTOM)

NOT TO SCALE

1

2

3

6

5

4

ORDERING GUIDE

Model Option

Temperature Range

Brand

1

Package Description

Package

ADG819BRM

–40

°C to +125°C

SNB

µSOIC (MicroSmall Outline IC)

RM-8

ADG819BRT

–40

°C to +125°C

SNB

SOT-23 (Plastic Surface-Mount)

RT-6

2

ADG819BCB

–40

°C to +85°C

SNB

MicroCSP (Micro Chip Scale Package)

CB-62

ADG820BRM

–40

°C to +125°C

SPB

µSOIC (MicroSmall Outline IC)

RM-8

ADG820BRT

–40

°C to +125°C

SPB

SOT-23 (Plastic Surface-Mount)

RT-6

2

NOTES

1Branding on these packages is limited to three characters due to space constraints.

2Contact factory for availability.

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