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B57891M0103000 Datasheet(PDF) 11 Page - TDK Electronics |
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B57891M0103000 Datasheet(HTML) 11 Page - TDK Electronics |
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11 / 28 page  3) Chip thickness depends on the resistance value. 1.3 Reel packing Packing survey Case size Chip thick- ness3) 8-mm tape Reel dimensions Packing units mm mm pcs./reel Blister Card- board A Tol. W1 Tol. W2 180-mm reel 330-mm reel 0402 0.5 x 180 3/+0 8.4 +1.5/ 0 14.4 max. 10000 0603 0.8 x 180 3/+0 8.4 +1.5/ 0 14.4 max. 4000 330 ±2.0 12.4 +1.5/ 0 18.4 max. 16000 0805 0.8 x 180 3/+0 8.4 +1.5/ 0 14.4 max. 4000 16000 1.2 x 330 ±2.0 12.4 +1.5/ 0 18.4 max. 3000 12000 1206 0.8 x 180 2/+0 8.4 +1.5/ 0 14.4 max. 4000 1.2 x 180 2/+0 8.4 +1.5/ 0 14.4 max. 2000 2 Packing codes The last two digits of the complete ordering code state the packing mode: Last two digits 60 SMD Cardboard tape 180-mm reel packing 62 SMD Blister tape 180-mm reel packing 70 SMD Cardboard tape 330-mm reel packing 72 SMD Blister tape 330-mm reel packing Temperature measurement and compensation B57891M Leaded NTC thermistors, lead spacing 2.5 mm M891 Page 11 of 28 Please read Cautions and warnings and Important notes at the end of this document. |
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