DATA SHEET • SKY67013-396LF: LOW-NOISE, LOW-CURRENT AMPLIFIER

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

201657F • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • April 22, 2015

9

02

4

6

810

12

14

16

18

20

22

24

Frequency (GHz)

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.0

0.5

1.5

0

–40 °C

+25 °C

+85 °C

Figure 26. Stability Factor (

μ2) vs Frequency and Temperature, Wide Band

Evaluation Board Description

The SKY67013-396LF Evaluation Board is used to test the

performance of the SKY67013-396LF LNA. An assembly drawing

for the Evaluation Board is shown in Figure 27. An Evaluation

Board schematic diagram is provided in Figure 28. Table 5

provides the Bill of Materials (BOM) list for Evaluation Board

components.

Package Dimensions

The PCB layout footprint for the SKY67013-396LF is provided in

Figure 29. Typical part markings are shown in Figure 30. Package

dimensions for the 8-pin DFN are shown in Figure 31, and tape

and reel dimensions are provided in Figure 32.

Package and Handling Information

Instructions on the shipping container label regarding exposure to

moisture after the container seal is broken must be followed.

Otherwise, problems related to moisture absorption may occur

when the part is subjected to high temperature during solder

assembly.

The SKY67013-396LF is rated to Moisture Sensitivity Level 1

(MSL1) at 260

C. It can be used for lead or lead-free soldering.

For additional information, refer to the Skyworks Application Note,

Solder Reflow Information, document number 200164.

Care must be taken when attaching this product, whether it is

done manually or in a production solder reflow environment.

Production quantities of this product are shipped in a standard

tape and reel format.