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ADuM131E0BRZ-RL7 Datasheet(PDF) 9 Page - Analog Devices

Part # ADuM131E0BRZ-RL7
Description  3.0 kV RMS/3.75 kV RMS Triple-Channel Digital Isolators
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADuM131E0BRZ-RL7 Datasheet(HTML) 9 Page - Analog Devices

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Data Sheet
ADuM130D/ADuM130E/ADuM131D/ADuM131E
Rev. A | Page 9 of 22
INSULATION AND SAFETY RELATED SPECIFICATIONS
For additional information, see www.analog.com/icouplersafety.
Table 9. R-16 Narrow Body [SOIC_N] Package
Parameter
Symbol
Value
Unit
Test Conditions/Comments
Rated Dielectric Insulation Voltage
3000
V rms
1-minute duration
Minimum External Air Gap (Clearance)
L (I01)
4.0
mm min
Measured from input terminals to output terminals,
shortest distance through air
Minimum External Tracking (Creepage)
L (I02)
4.0
mm min
Measured from input terminals to output terminals,
shortest distance path along body
Minimum Clearance in the Plane of the Printed
Circuit Board (PCB Clearance)
L (PCB)
4.5
mm min
Measured from input terminals to output terminals,
shortest distance through air, line of sight, in the PCB
mounting plane
Minimum Internal Gap (Internal Clearance)
25.5
μm min
Insulation distance through insulation
Tracking Resistance (Comparative Tracking Index)
CTI
>400
V
DIN IEC 112/VDE 0303 Part 1
Material Group
II
Material Group (DIN VDE 0110, 1/89, Table 1)
Table 10. RW-16 Wide Body [SOIC_W] Package
Parameter
Symbol
Value
Unit
Test Conditions/Comments
Rated Dielectric Insulation Voltage
3750
V rms
1-minute duration
Minimum External Air Gap (Clearance)
L (I01)
7.8
mm min
Measured from input terminals to output terminals,
shortest distance through air
Minimum External Tracking (Creepage)
L (I02)
7.8
mm min
Measured from input terminals to output terminals,
shortest distance path along body
Minimum Clearance in the Plane of the Printed
Circuit Board (PCB Clearance)
L (PCB)
8.1
mm min
Measured from input terminals to output terminals,
shortest distance through air, line of sight, in the PCB
mounting plane
Minimum Internal Gap (Internal Clearance)
25.5
μm min
Insulation distance through insulation
Tracking Resistance (Comparative Tracking Index)
CTI
>400
V
DIN IEC 112/VDE 0303 Part 1
Material Group
II
Material Group (DIN VDE 0110, 1/89, Table 1)
PACKAGE CHARACTERISTICS
Table 11.
Parameter
Symbol
Min
Typ
Max
Unit
Test Conditions/Comments
Resistance (Input to Output)1
RI-O
1013
Capacitance (Input to Output)1
CI-O
2.2
pF
f = 1 MHz
Input Capacitance2
CI
4.0
pF
IC Junction to Ambient Thermal Resistance
R-16 Narrow Body [SOIC_N] Package
θJA
76
°C/W
Thermocouple located at center of package underside
RW-16 Wide Body [SOIC_W] Package
θJA
45
°C/W
Thermocouple located at center of package underside
1
The device is considered a 2-terminal device: Pin 1 through Pin 8 are shorted together, and Pin 9 through Pin 16 are shorted together.
2
Input capacitance is from any input data pin to ground.


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