JUNCTION TEM

PART NUMBER

PACKAGE STYLE

CONDITION

Ø

PERATURE

T =25°C T =85°C T =125°C

JA

AA

A

HI-1585PCI / T / M

48-Plastic chip-

Heat sink

49°C/W

49°C

109°C

149°C

scale package (QFN)

unsoldered

Data taken at VDD=3.3V, continuous transmission at 1Mbit/s, single transmitter enabled.

THERMAL CHARACTERISTICS

HEAT SINK

The HI-1585PCI/T/M uses a plastic chip-scale package

(QFN).

the printed circuit board

for optimum thermal dissipation.

The heat sink is

electrically isolated and may be soldered to any

convenient power or ground plane.

These packages include a metal heat sink

located on the bottom surface of the device. This heat

sink may be soldered down to

Isolation

Transformer

BUS A/B

BUS A/B

GND

RXA/B

TXA/B

TXA/B

RXA/B

Each Bus

MIL-STD-1553

Transceiver

70Ω

Point

“AT”

1:2.07

HI-1585

Figure 7. Transformer Coupled Test Circuit

APPLICATIONS NOTE

Holt Applications Note AN-500 provides circuit design notes

regarding the use of Holt's family of MIL-STD-1553

transceivers. Layout considerations, as well as

recommended interface and protection components are

included.

Isolation

Transformer

BUS A/B

BUS A/B

GND

RXA/B

TXA/B

TXA/B

RXA/B

Each Bus

MIL-STD-1553

Transceiver

55Ω

35Ω

55Ω

Point

“AD”

1:2.65

HI-1585

Figure 6. Direct Coupled Test Circuit

HI-1585

HOLT INTEGRATED CIRCUITS

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