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DAC1282IPW Datasheet(PDF) 4 Page - Texas Instruments |
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DAC1282IPW Datasheet(HTML) 4 Page - Texas Instruments |
4 / 46 page DAC1282, DAC1282A SBAS490B – DECEMBER 2011 – REVISED MAY 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings (1) Over operating free-air temperature range, unless otherwise noted. MIN MAX UNIT AVDD to AVSS –0.3 +5.5 V AVSS to DGND –2.8 +0.3 V DVDD to DGND –0.3 +3.6 V Input current continuous –10 +10 mA Analog input/output voltage AVSS – 0.3 AVDD + 0.3 V Switch current –60 +60 mA Digital input voltage to DGND –0.3 DVDD + 0.3 V Operating temperature range –50 +125 °C Storage temperature, Tstg –60 +150 °C (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. 7.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 Electrostatic V(ESD) V discharge Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Thermal Information PW (TSSOP) THERMAL METRIC(1) UNIT 24 PINS RθJA Junction-to-ambient thermal resistance 78.3 RθJC(top) Junction-to-case (top) thermal resistance 12.1 RθJB Junction-to-board thermal resistance 33.8 °C/W ψJT Junction-to-top characterization parameter 0.3 ψJB Junction-to-board characterization parameter 33.5 RθJC(bot) Junction-to-case (bottom) thermal resistance N/A (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DAC1282 |
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