IS25LQ025B datasheet(4/66 Pages) ISSI

Part #	IS25LQ025B

Description	3V QUAD SERIAL FLASH MEMORY WITH MULTI-I/O SPI

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Manufacturer	ISSI [Integrated Silicon Solution, Inc]

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IS25LQ025/512/010/020/040B

Integrated Silicon Solution, Inc.- www.issi.com

Rev.A

12/12/2014

4

8.23 READ PRODUCT IDENTIFICATION (RDID, ABh) ............................................................................42

8.24 READ PRODUCT IDENTIFICATION BY JEDEC ID OPERATION (RDJDID, 9Fh) ...........................43

8.25 READ DEVICE MANUFACTURER AND DEVICE ID OPERATION (RDMDID, 90h) ........................44

8.26 READ UNIQUE ID NUMBER (RDUID, 4Bh).......................................................................................45

8.27 READ SFDP OPERATION (RDSFDP, 5Ah).......................................................................................46

8.28 SOFTWARE RESET (RESET-ENABLE (RSTEN, 66h) AND RESET (RST, 99h).............................47

8.29 SECURITY INFORMATION ROW (OTP AREA) ................................................................................48

8.30 INFORMATION ROW PROGRAM OPERATION (IRP, 62h)..............................................................48

8.31 INFORMATION ROW READ OPERATION (IRRD, 68h) ...................................................................50

9.

ELECTRICAL CHARACTERISTICS ..........................................................................................................51

9.1 ABSOLUTE MAXIMUM RATINGS

(1)....................................................................................................51

9.2 OPERATING RANGE ...........................................................................................................................51

9.3 DC CHARACTERISTICS ......................................................................................................................51

9.4 AC MEASUREMENT CONDITIONS ....................................................................................................52

9.5 AC CHARACTERISTICS ......................................................................................................................53

9.6 SERIAL INPUT/OUTPUT TIMING ........................................................................................................54

9.7 POWER-UP AND POWER-DOWN ......................................................................................................55

9.8 PROGRAM/ERASE PERFORMANCE .................................................................................................56

9.9 RELIABILITY CHARACTERISTICS......................................................................................................56

10. PACKAGE TYPE INFORMATION .............................................................................................................57

10.1 8-Pin JEDEC 208mil Broad Small Outline Integrated Circuit (SOIC) Package (JB).........................57

10.2 8-Pin JEDEC 150mil Broad Small Outline Integrated Circuit (SOIC) Package (JN) ........................58

10.3 8-Pin 150mil TSSOP Package (JD) ..................................................................................................59

10.4 8-Pin 150mil VVSOP Package (JV) ..................................................................................................60

10.5 8-Contact Ultra-Thin Small Outline No-Lead (WSON) Package 6x5mm (JK) ..................................62

10.6 8-Contact Ultra-Thin Small Outline No-Lead (USON) Package 2x3mm (JU)...................................63

11. ORDERING INFORMATION ......................................................................................................................64

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