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MAAD-011021-DIESMB Datasheet(PDF) 1 Page - M/A-COM Technology Solutions, Inc.

Part # MAAD-011021-DIESMB
Description  Digital Attenuator, 6-Bit, 0.5 dB LSB step
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Manufacturer  MA-COM [M/A-COM Technology Solutions, Inc.]
Direct Link  http://www.macomtech.com
Logo MA-COM - M/A-COM Technology Solutions, Inc.

MAAD-011021-DIESMB Datasheet(HTML) 1 Page - M/A-COM Technology Solutions, Inc.

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Digital Attenuator, 6-Bit, 0.5 dB LSB step
DC - 40 GHz
Rev. V3
MAAD-011021-000DIE
1
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
1
Features
 6-bit, 0.5 dB LSB, 31.5 dB range
 DC to 40 GHz operation
 Integrated TTL 0/+5V control
 +/- 0.5 dB typical bit error
 Low RMS phase 4.3° @ 20 GHz
 Die size: 1.55 x 0.95 x 0.1 mm
 ESD protection for all controls and bias
 100% On-wafer DC & RF Tested
Description
The MAAD-011021 is a wide band 6-bit digital
attenuator covering DC to 40 GHz. The attenuation
bit-values are 0.5 dB LSB (least significant bit), 1, 2,
4, 8, and 16 dB for a total attenuation of 31.5 dB.
Attenuation error is typically less than +/- 0.5 dB,
RMS phase error is less than 5 degrees at 20 GHz,
and typical insertion loss is 7.1 dB at 15 GHz.
Return loss is typically 12 dB across all frequencies
and attenuation states.
The attenuator integrates an inverter to allow a
single control for series/shunt attenuation. Inverter
requires a -5 V supply (VCC) and 17 mA typical, logic
is 0 V / +5 V.
The device is also available in a lead-free 3 mm
16-lead PQFN plastic package; order part number
MAAD-011021-TR0500.
Ordering Information1
Part Number
Package
MAAD-011021-0GPDIE
Die in Gel Pack
MAAD-011021-DIESMB
Die on Sample Board
* Restrictions on Hazardous Substances, European Union Directive 2011/65/EU.
Functional Schematic
Pad Configuration
Pad No.
Pad Name
Function
1
V1
0.5 dB bit control
2
V2
1 dB bit control
3
V3
2 dB bit control
4
V4
4 dB bit control
5
V5
8 dB bit control
6
V6
16 dB bit control
7
VCC
-5 V Bias
8
RFIN
RF Input
9
RFOUT
RF Output
10
GND
RF and DC Ground
11
Pad2
Back of die
10
8
1
2
3
7
9
6
5
4
0.5
dB
1
dB
2
dB
4
dB
8
dB
16
dB
VCC
GND
GND
RFIN
GND
V1
V2
V3
V4
V5
V6
GND
RFOUT
GND
2. The pad on the backside of the die must be connected to RF,
DC and thermal ground.
1. All sample boards include 3 loose parts.


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