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MAAD-011021-DIESMB Datasheet(PDF) 1 Page - M/A-COM Technology Solutions, Inc. |
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MAAD-011021-DIESMB Datasheet(HTML) 1 Page - M/A-COM Technology Solutions, Inc. |
1 / 9 page Digital Attenuator, 6-Bit, 0.5 dB LSB step DC - 40 GHz Rev. V3 MAAD-011021-000DIE 1 1 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support 1 Features 6-bit, 0.5 dB LSB, 31.5 dB range DC to 40 GHz operation Integrated TTL 0/+5V control +/- 0.5 dB typical bit error Low RMS phase 4.3° @ 20 GHz Die size: 1.55 x 0.95 x 0.1 mm ESD protection for all controls and bias 100% On-wafer DC & RF Tested Description The MAAD-011021 is a wide band 6-bit digital attenuator covering DC to 40 GHz. The attenuation bit-values are 0.5 dB LSB (least significant bit), 1, 2, 4, 8, and 16 dB for a total attenuation of 31.5 dB. Attenuation error is typically less than +/- 0.5 dB, RMS phase error is less than 5 degrees at 20 GHz, and typical insertion loss is 7.1 dB at 15 GHz. Return loss is typically 12 dB across all frequencies and attenuation states. The attenuator integrates an inverter to allow a single control for series/shunt attenuation. Inverter requires a -5 V supply (VCC) and 17 mA typical, logic is 0 V / +5 V. The device is also available in a lead-free 3 mm 16-lead PQFN plastic package; order part number MAAD-011021-TR0500. Ordering Information1 Part Number Package MAAD-011021-0GPDIE Die in Gel Pack MAAD-011021-DIESMB Die on Sample Board * Restrictions on Hazardous Substances, European Union Directive 2011/65/EU. Functional Schematic Pad Configuration Pad No. Pad Name Function 1 V1 0.5 dB bit control 2 V2 1 dB bit control 3 V3 2 dB bit control 4 V4 4 dB bit control 5 V5 8 dB bit control 6 V6 16 dB bit control 7 VCC -5 V Bias 8 RFIN RF Input 9 RFOUT RF Output 10 GND RF and DC Ground 11 Pad2 Back of die 10 8 1 2 3 7 9 6 5 4 0.5 dB 1 dB 2 dB 4 dB 8 dB 16 dB VCC GND GND RFIN GND V1 V2 V3 V4 V5 V6 GND RFOUT GND 2. The pad on the backside of the die must be connected to RF, DC and thermal ground. 1. All sample boards include 3 loose parts. |
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