HMIC™ Silicon PIN Diode Switches

with Integrated Bias Network

Rev. V6

MA4SWx10B-1 Series

7

7

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7

7. Topside and backside metallization is gold, 2.5 µm thick typical.

8. Yellow areas indicate ribbon/wire bonding pads

DIM

INCHES

MM

MIN.

MAX.

MIN.

MAX.

A

0.066

0.070

1.680

1.780

B

0.048

0.052

1.230

1.330

C

0.004

0.100

0.006

0.150

D

0.004

0.090

0.006

0.140

E

0.012

0.292

0.013

0.317

F

0.029

0.735

0.030

0.760

G

0.030

0.766

0.031

0.791

H

0.029

0.732

0.030

0.757

J

0.005

REF.

0.129

REF.

K

0.005

REF.

0.129

REF.

MA4SW210B-1

MA4SW310B-1

DIM

INCHES

MM

MIN.

MAX.

MIN.

MAX.

A

0.071

0.072

1.807

1.833

B

0.071

0.072

1.797

1.823

C

0.0045

0.100

0.0055

0.150

D

0.031

0.781

0.032

0.807

E

0.029

0.732

0.030

0.758

F

0.006

0.152

0.007

0.178

G

0.004

0.099

0.005

0.125

H

0.005

0.125

0.006

0.151

J

0.034

0.035

0.871

0.897

K

0.064

0.065

1.617

1.643

L

0.066

0.067

1.683

1.709

M

0.005

REF.

0.1250

REF.

N

0.0046

REF.

0.1180

REF.