AIM1714xB6MC7D5yzz

AIM™ in a VIA Package

Rev 1.0

vicorpower.com

Page 10 of 14

12/2015

800 927.9474

Thermal Considerations

The AIM in a VIA package can be cooled using Single side cooling.

Since the AIM has a maximum internal temperature rating, it is

necessary to estimate this internal temperature based on a system-level

thermal solution. To this purpose, it is helpful to simplify the thermal

solution into a roughly equivalent circuit where power dissipation is

modeled as a current source, isothermal surface temperatures are

represented as voltages sources, and thermal resistances are

represented as resistors. Figure 4 shows the bottom side cooling

“thermal circuit” for the AIM in VIA package:

characteristic of the VIA package and the bottom surface temperature is

thermal conductivity (e.g. aluminum or copper) to maintain

temperature uniformity across the bottom side.

P

DISS

+

T

C_BOT

R

JC

s

s

Maximum internal temperature

Figure 4 – Bottom-side cooling VIA thermal model