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XP1026-BD-000V Datasheet(PDF) 1 Page - M/A-COM Technology Solutions, Inc. |
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XP1026-BD-000V Datasheet(HTML) 1 Page - M/A-COM Technology Solutions, Inc. |
1 / 13 page Power Amplifier 27.0-32.0 GHz Rev. V1 XP1026-BD 1 1 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support 1 Features Ka-Band 2W Power Amplifier 21.0 dB Small Signal Gain +33.0 dBm Saturated Output Power +40.0 dBm Output Third Order Intercept (OIP3) 100% On-Wafer RF, DC and Output Power Testing 100% Visual Inspection to MIL-STD-883 Method 2010 RoHS* Compliant and 260°C Reflow Compatible Description M/A-COM Tech’s three stage 27.0-32.0 GHz GaAs MMIC power amplifier has a small signal gain of 21.0 dB with +33 dBm saturated output power. This MMIC uses M/A-COM Tech’s GaAs PHEMT device model technology, and is based upon electron beam lithography to ensure high repeatability and uniformity. The chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter- wave Point-to-Point Radio, LMDS, SATCOM and VSAT applications. Ordering Information Part Number Package XP1026-BD-000V “V” - vacuum release gel paks Absolute Maximum Ratings Parameter Absolute Max. Supply Voltage (Vd) +6.0 VDC2 Supply Current (Id1,2,3) 165,415,790 mA Gate Bias Voltage (Vg) +0.3 VDC Input Power (Pin) +22 dBm Storage Temperature (Tstg) -65 °C to +165 °C Operating Temperature (Ta) -55 °C to +85 °C Channel Temperature (Tch)1 175 °C 1. Channel temperature directly affects a device's MTTF. Chan- nel temperature should be kept as low as possible to maximize lifetime. 2. Under pulsed bias conditions, under CW Psat conditions fur- ther reduction in max supply voltage (~0.5V) is recommended. Chip Device Layout |
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