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HMC463

v03.0304

GaAs PHEMT MMIC LOW NOISE

AGC AMPLIFIER, 2.0 - 20.0 GHz

Mounting & Bonding Techniques for Millimeterwave GaAs MMICs

The die should be attached directly to the ground plane with conductive epoxy (see HMC general Handling, Mounting,

Bonding Note).

50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina thin film substrates are recommended for

bringing RF to and from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the

die should be raised 0.150mm (6 mils) so that the surface of the die is coplanar with the surface of the substrate. One

way to accomplish this is to attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil) thick molybdenum heat spreader

(moly-tab) which is then attached to the ground plane (Figure 2).

Microstrip substrates should brought as close to the die as possible in order to minimize bond wire length. Typical die-

to-substrate spacing is 0.076mm to 0.152 mm (3 to 6 mils).