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TPS2041CDBVT Datasheet(PDF) 6 Page - Texas Instruments |
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TPS2041CDBVT Datasheet(HTML) 6 Page - Texas Instruments |
6 / 39 page 6 TPS2000C, TPS2001C, TPS2041C, TPS2051C, TPS2061C TPS2065C, TPS2065C-2, TPS2068C, TPS2069C, TPS2069C-2 SLVSAU6H – JUNE 2011 – REVISED APRIL 2016 www.ti.com Product Folder Links: TPS2000C TPS2001C TPS2041C TPS2051C TPS2061C TPS2065C TPS2065C-2 TPS2068C TPS2069C TPS2069C-2 Submit Documentation Feedback Copyright © 2011–2016, Texas Instruments Incorporated (1) Some package and current rating may request an ambient temperature derating of 85°C. 7.3 Recommended Operating Conditions MIN NOM MAX UNIT VIN Input voltage, IN 4.5 5.5 V VEN Input voltage, EN or EN 0 5.5 V VIH High-level input voltage, EN or EN 2 V VIL Low-level input voltage, EN or EN 0.7 V IOUT Continuous output current, OUT(1) TPS2041C and TPS2051C 0.5 A TPS2061C, TPS2065C and TPS2065C-2 1 TPS2068C, TPS2069C and TPS2069C-2 1.5 TPS2000C and TPS2001C 2 TJ Operating junction temperature –40 125 °C IFLT Sink current into FLT 0 5 mA (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. (2) Rated at 0.5 A or 1 A. (3) Rated at 1.5 A or 2 A. 7.4 Thermal Information: SOT-23 THERMAL METRIC(1) TPS20xxC, TPS20xxC-2 UNIT DBV (SOT-23)(2) DBV (SOT-23)(3) 5 PINS 5 PINS RθJA Junction-to-ambient thermal resistance 224.9 220.4 °C/W RθJCtop Junction-to-case (top) thermal resistance 95.2 89.7 °C/W RθJB Junction-to-board thermal resistance 51.4 46.9 °C/W ψJT Junction-to-top characterization parameter 6.6 5.2 °C/W ψJB Junction-to-board characterization parameter 50.3 46.2 °C/W RθJCbot Junction-to-case (bottom) thermal resistance — — °C/W RθJACustom See Power DIssipation and Junction Temperature 139.3 134.9 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. (2) Rated at 0.5 A or 1 A. (3) Rated at 1.5 A or 2 A. (4) Rated at 2 A. 7.5 Thermal Information: MSOP-PowerPAD THERMAL METRIC(1) TPS20xxC, TPS20xxC-2 UNIT DGN (MSOP- PowerPAD)(2) DGN (MSOP- PowerPAD)(3) DGK (VSSOP)(4) 8 PINS 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 72.1 67.1 205.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance 87.3 80.8 94.3 °C/W RθJB Junction-to-board thermal resistance 42.2 37.2 126.9 °C/W ψJT Junction-to-top characterization parameter 7.3 5.6 24.7 °C/W ψJB Junction-to-board characterization parameter 42 36.9 125.2 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 39.2 32.1 — °C/W RθJACustom See Power DIssipation and Junction Temperature 66.5 61.3 110.3 °C/W |
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Similar Description - TPS2041CDBVT |
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