UCC27321, UCC27322

UCC37321, UCC37322

SLUS504H – SEPTEMBER 2002 – REVISED JANUARY 2016

www.ti.com

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

–0.3

16

V

0.6

A

–0.3

(3)

V

Enable voltage (ENBL)

–0.3

(3)

V

D package

650

mW

DGN package

3

W

P package

350

mW

Lead temperature (soldering, 10 s)

300

°C

–55

150

°C

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating ConditionsRecommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may

affect device reliability.

(2)

All voltages are with respect to GND. Currents are positive into, negative out of the specified terminal.

(3)

Whichever is larger

7.2 ESD Ratings

VALUE

UNIT

±2500

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage, VDD

4.5

15

V

7.4 Thermal Information

UCC27322

UCC27321

DGN (MSOP-

D (SOIC)

P (PDIP)

UNIT

PowerPAD)

8 PINS

8 PINS

8 PINS

Junction-to-ambient thermal resistance

56.6

55.9

56.7

°C/W

Junction-to-case (top) thermal resistance

52.8

45.3

52.9

°C/W

Junction-to-board thermal resistance

32.6

32.6

32.7

°C/W

Junction-to-top characterization parameter

1.8

23.0

1.8

°C/W

Junction-to-board characterization parameter

32.3

32.5

32.4

°C/W

Junction-to-case (bottom) thermal resistance

5.9

—

5.9

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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