HMIC™ Silicon SP6T PIN Diode Switch

with Integrated Bias Network

Rev. V4

MA4SW610B-1

6

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Cleanliness

The chips should be handled in a clean environment

free of dust and organic contamination.

Wire / Ribbon Bonding

Thermo compression wedge bonding using 0.003” x

0.00025” ribbon or 0.001” diameter gold wire is

recommended. A work stage temperature of

150°C - 200°C, tool tip temperature of 120°C - 150°

and a downward force of 18 to 22 grams should be

used. If ultrasonic energy is necessary, it should be

adjusted to the minimum level required to achieve a

good bond. Excessive power or force will fracture

the silicon beneath the bond pad causing it to lift.

RF bond wires and ribbons should be kept as short

as possible for optimum RF performance.

Chip Mounting

HMIC switches have Ti-Pt-Au backside metallization

and can be mounted using a gold-tin eutectic solder

or conductive epoxy. Mounting surface must be free

of contamination and flat.

Eutectic Die Attachment

An 80/20, gold-tin, eutectic solder is recommended.

chip onto the circuit board re-flow the solder by

applying hot forming gas (95/5 Ni/H) to the top

surface of the chip. Temperature should be

more than 20 seconds. Typically no more than three

seconds is necessary for attachment. Solders rich in

tin should be avoided

Epoxy Die Attachment

A minimum amount of epoxy, 1 - 2 mils thick, should

be used to attach chip. A thin epoxy fillet should be

visible around the outer perimeter of the chip after

placement. Epoxy cure time is typically 1 hour at

150°C.