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MA4SW610B-1 Datasheet(PDF) 6 Page - M/A-COM Technology Solutions, Inc. |
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MA4SW610B-1 Datasheet(HTML) 6 Page - M/A-COM Technology Solutions, Inc. |
6 / 7 page HMIC™ Silicon SP6T PIN Diode Switch with Integrated Bias Network Rev. V4 MA4SW610B-1 6 6 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support 6 Cleanliness The chips should be handled in a clean environment free of dust and organic contamination. Wire / Ribbon Bonding Thermo compression wedge bonding using 0.003” x 0.00025” ribbon or 0.001” diameter gold wire is recommended. A work stage temperature of 150°C - 200°C, tool tip temperature of 120°C - 150° and a downward force of 18 to 22 grams should be used. If ultrasonic energy is necessary, it should be adjusted to the minimum level required to achieve a good bond. Excessive power or force will fracture the silicon beneath the bond pad causing it to lift. RF bond wires and ribbons should be kept as short as possible for optimum RF performance. Chip Mounting HMIC switches have Ti-Pt-Au backside metallization and can be mounted using a gold-tin eutectic solder or conductive epoxy. Mounting surface must be free of contamination and flat. Eutectic Die Attachment An 80/20, gold-tin, eutectic solder is recommended. Adjust the work surface temperature to 255oC and the tool tip temperature to 265oC. After placing the chip onto the circuit board re-flow the solder by applying hot forming gas (95/5 Ni/H) to the top surface of the chip. Temperature should be approximately 290oC and not exceed 320oC for more than 20 seconds. Typically no more than three seconds is necessary for attachment. Solders rich in tin should be avoided Epoxy Die Attachment A minimum amount of epoxy, 1 - 2 mils thick, should be used to attach chip. A thin epoxy fillet should be visible around the outer perimeter of the chip after placement. Epoxy cure time is typically 1 hour at 150°C. |
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