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HMC326MS8 Datasheet(PDF) 5 Page - Hittite Microwave Corporation |
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HMC326MS8 Datasheet(HTML) 5 Page - Hittite Microwave Corporation |
5 / 6 page MICROWAVE CORPORATION 8 - 102 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com 8 HMC326MS8G v04.1203 Evaluation PCB The circuit board used in the final application should use RF circuit design techniques. Signal lines should have 50 ohm impedance while the package ground leads and exposed paddle should be connected directly to the ground plane similar to that shown. A sufficient number of VIA holes should be used to connect the top and bottom ground planes. The evaluation board should be mounted to an appropriate heat sink. The evaluation circuit board shown is available from Hittite upon request. List of Material GaAs InGaP HBT MMIC DRIVER AMPLIFIER, 3.0 - 4.5 GHz Item Description J1 - J2 PC Mount SMA RF Connector J3 2mm DC Header C1 - C2 330 pF Capacitor, 0603 Pkg. C3 0.7 pF Capacitor, 0603 Pkg. C4 3.0 pF Capacitor, 0402 Pkg. C5 2.2 µF Capacitor, Tantalum L1 3.3 nH Inductor, 0805 Pkg. U1 HMC326MS8G Amplifier PCB* 104106 Eval Board *Circuit Board Material: Rogers 4350 |
Similar Part No. - HMC326MS8 |
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Similar Description - HMC326MS8 |
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